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MSP430F5522IRGCR - Texas Instruments

Description: 25 MHz MCU with Integrated USB Phy, 32KB Flash, 8KB RAM, 12Bit/10 Channel ADC, 32BIT HW Multiplier

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PCB Footprints
MSP430F5522IRGCR - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RGC (S-PVQFN-N64)_1
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3D Models
MSP430F5522IRGCR - Texas Instruments  - 3D model - Quad Flat No-Lead - RGC (S-PVQFN-N64)_1
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MSP430F5522IRGCR Details

  • Manufacturer Part Number:

    MSP430F5522IRGCR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    VQFN-64

  • Pin Count:

    64

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Has ADC:

    YES

  • Bit Size:

    16

  • Boundary Scan:

    YES

  • CPU Family:

    MSP430

  • Clock Frequency-Max:

    32 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQCC-N64

  • JESD-609 Code:

    e4

  • Length:

    9 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    3

  • Number of I/O Lines:

    47

  • Number of Serial I/Os:

    4

  • Number of Terminals:

    64

  • Number of Timers:

    4

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC64,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    8192

  • RAM (words):

    8

  • ROM (words):

    32768

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1 mm

  • Speed:

    25 MHz

  • Supply Current-Max:

    11 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    9 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

MSP430F5522IRGCR Frequently Asked Questions (FAQs)

  • The maximum clock frequency of the MSP430F5522IRGCR is 25 MHz.
  • To configure the MSP430F5522IRGCR for low power consumption, use the low-power modes (LPM3, LPM4) and adjust the clock frequency, disable unused peripherals, and use the Power Management Module (PMM) to control power consumption.
  • Yes, the MSP430F5522IRGCR can operate with a 3.3V power supply, but it is recommended to use a 1.8V to 3.6V power supply for optimal performance.
  • The MSP430F5522IRGCR can be programmed using the Texas Instruments Code Composer Studio (CCS) or IAR Embedded Workbench development environments, or using the MSP430 Flash Emulation Tool (FET) or the MSP430 Universal Serial Communication Interface (USCI) module.
  • The maximum current consumption of the MSP430F5522IRGCR is approximately 2.5 mA at 25 MHz and 3.3V power supply.

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MSP430F5522IRGCR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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