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MSP430F5526IRGCR - Texas Instruments

Description: MIXED SIGNAL MICROCONTROLLER

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MSP430F5526IRGCR - Texas Instruments PCB footprint - Other - Other - QFN50P900X900X100-65N
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3D Models
MSP430F5526IRGCR - Texas Instruments  - 3D model - Other - QFN50P900X900X100-65N
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MSP430F5526IRGCR Details

  • Manufacturer Part Number:

    MSP430F5526IRGCR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    VQFN-64

  • Pin Count:

    64

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Has ADC:

    YES

  • Additional Feature:

    ALSO OPERATES AT 1.8 MINIMUM SUPPLY AT 8 MHZ

  • Bit Size:

    16

  • Boundary Scan:

    YES

  • CPU Family:

    MSP430

  • Clock Frequency-Max:

    32 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQCC-N64

  • JESD-609 Code:

    e4

  • Length:

    9 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    3

  • Number of I/O Lines:

    47

  • Number of Serial I/Os:

    4

  • Number of Terminals:

    64

  • Number of Timers:

    4

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC64,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    6144

  • RAM (words):

    6

  • ROM (words):

    98304

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1 mm

  • Speed:

    25 MHz

  • Supply Current-Max:

    11 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    9 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

MSP430F5526IRGCR Frequently Asked Questions (FAQs)

  • The maximum clock frequency for the MSP430F5526IRGCR is 25 MHz, but it can be overclocked up to 30 MHz with reduced voltage and temperature range.
  • To configure the MSP430F5526IRGCR for low power consumption, use the low-power modes (LPM3, LPM4, etc.) and adjust the clock frequency, disable unused peripherals, and use the built-in brown-out reset (BOR) and power-on reset (POR) features.
  • Yes, the MSP430F5526IRGCR can operate with a 3.3V power supply, but the maximum clock frequency may be limited to 12 MHz. Check the datasheet for specific voltage and frequency combinations.
  • The MSP430F5526IRGCR can be programmed using the Texas Instruments Code Composer Studio (CCS) or IAR Embedded Workbench development environments, or using the MSP430 Flash Emulation Tool (FET) or the MSP430 Debug Stack (MSP-DS).
  • The MSP430F5526IRGCR has 128 KB of flash memory, but the maximum amount of flash memory that can be used for program storage is 96 KB, with the remaining 32 KB reserved for information memory and boot loader.

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MSP430F5526IRGCR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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