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MSP430F6659IZQWR - Texas Instruments

Description: MSP430F66xx Mixed Signal Microcontroller

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PCB Footprints
MSP430F6659IZQWR - Texas Instruments PCB footprint - BGA - BGA - ZQW (S-PBGA-N113)
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3D Models
MSP430F6659IZQWR - Texas Instruments  - 3D model - BGA - ZQW (S-PBGA-N113)
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MSP430F6659IZQWR Details

  • Manufacturer Part Number:

    MSP430F6659IZQWR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    BGA-113

  • Pin Count:

    113

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Has ADC:

    YES

  • Additional Feature:

    OPERATES AT 1.8V MIN SUPPLY AT 8 MHZ, ALSO HAVING ADDITIONAL 2KB SRAM WHEN USB NOT IN USE

  • Bit Size:

    16

  • Boundary Scan:

    YES

  • CPU Family:

    MSP430

  • Clock Frequency-Max:

    32 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PBGA-B113

  • JESD-609 Code:

    e1

  • Length:

    7 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    6

  • Number of External Interrupts:

    8

  • Number of I/O Lines:

    74

  • Number of Serial I/Os:

    2

  • Number of Terminals:

    113

  • Number of Timers:

    4

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA113,12X12,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    65536

  • RAM (words):

    64

  • ROM (words):

    524288

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1 mm

  • Speed:

    20 MHz

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

MSP430F6659IZQWR Frequently Asked Questions (FAQs)

  • The maximum clock frequency of the MSP430F6659IZQWR is 25 MHz.
  • To configure the MSP430F6659IZQWR for low power consumption, use the low-power modes (LPM3, LPM4) and adjust the clock frequency, disable unused peripherals, and use the Power Management Module (PMM) to control the power modes.
  • Yes, the MSP430F6659IZQWR can be used with an external crystal oscillator. The device has an internal oscillator, but an external crystal oscillator can be used for more accurate clocking.
  • The MSP430F6659IZQWR can be programmed using the Texas Instruments Code Composer Studio (CCS) or IAR Embedded Workbench. The device can be programmed using the JTAG or Spy-Bi-Wire interfaces.
  • The MSP430F6659IZQWR has 328KB of flash memory available for program storage.

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MSP430F6659IZQWR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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