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MSP430F6777IPZ - Texas Instruments

Description: 16-bit Microcontrollers - MCU Mixed Signal MCU

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MSP430F6777IPZ - Texas Instruments - PCB symbol
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PCB Footprints
MSP430F6777IPZ - Texas Instruments PCB footprint - Quad Flat Packages - Quad Flat Packages - PZ (S-PQFP-G100
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MSP430F6777IPZ - Texas Instruments - 3D model - Quad Flat Packages - PZ (S-PQFP-G100
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MSP430F6777IPZ Details

  • Manufacturer Part Number:

    MSP430F6777IPZ

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFP

  • Pin Count:

    100

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.75

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Has ADC:

    YES

  • Additional Feature:

    IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

  • Bit Size:

    16

  • Bus Compatibility:

    I2C; SPI; UART

  • CPU Family:

    MSP430

  • Clock Frequency-Max:

    25 MHz

  • JESD-30 Code:

    S-PQFP-G100

  • JESD-609 Code:

    e4

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP100,.63SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    32768

  • RAM (words):

    32

  • ROM (words):

    262144

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    25 MHz

  • Supply Current-Max:

    11.75 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.8 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

MSP430F6777IPZ Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MSP430F6777IPZ is -40°C to 85°C, as specified in the datasheet. However, it's essential to note that the device can operate at temperatures beyond this range, but with reduced performance and reliability.
  • To configure the MSP430F6777IPZ for low-power operation, you can use the Power Management Module (PMM) to control the power modes. You can also use the Low Power Mode (LPM) to reduce power consumption. Additionally, you can disable unused peripherals and use the Dynamic Voltage Scaling (DVS) feature to optimize power consumption.
  • The maximum clock frequency for the MSP430F6777IPZ is 20 MHz, as specified in the datasheet. However, the device can operate at higher frequencies using an external clock source, but this may require additional circuitry and design considerations.
  • The MSP430F6777IPZ has a built-in Watchdog Timer (WDT) module that can be configured to reset the device or generate an interrupt if the timer expires. You can enable the WDT by setting the WDTCTL register and configuring the WDT interval using the WDTPW and WDTSSEL registers.
  • Yes, the MSP430F6777IPZ can be used with an external crystal oscillator. You can connect the crystal oscillator to the XIN and XOUT pins and configure the XT2 clock source using the UCSCTL6 register. The device can also be configured to use an external clock source or an internal Very Low Power Oscillator (VLO).

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MSP430F6777IPZ Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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