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MSP430FR5732IPW - Texas Instruments

Description: MCU 16-bit MSP430 RISC ROMLess 2.5V/3.3V 28-Pin TSSOP Tube

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MSP430FR5732IPW - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PW(R-PDSO-G28)
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MSP430FR5732IPW Details

  • Manufacturer Part Number:

    MSP430FR5732IPW

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SSOP

  • Pin Count:

    28

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.75

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Has ADC:

    YES

  • Bit Size:

    16

  • Boundary Scan:

    YES

  • CPU Family:

    MSP430

  • Clock Frequency-Max:

    24 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e4

  • Length:

    9.7 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of DMA Channels:

    3

  • Number of I/O Lines:

    21

  • Number of Serial I/Os:

    1

  • Number of Terminals:

    28

  • Number of Timers:

    5

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP28,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    1024

  • RAM (words):

    1

  • ROM (words):

    8192

  • ROM Programmability:

    FRAM

  • Seated Height-Max:

    1.2 mm

  • Speed:

    24 MHz

  • Supply Current-Max:

    4.3 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

MSP430FR5732IPW Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MSP430FR5732IPW is -40°C to 85°C, as specified in the datasheet. However, it's recommended to operate the device within the recommended operating temperature range of -40°C to 70°C for optimal performance and reliability.
  • To configure the MSP430FR5732IPW for low-power operation, you can use the Power Management Module (PMM) to control the power modes. The PMM allows you to select from various power modes, such as LPM0 (Low Power Mode 0), LPM1, LPM2, LPM3, and LPM4, each with decreasing power consumption. You can also use the FRAM (Ferroelectric Random Access Memory) to store data and reduce power consumption.
  • The maximum clock frequency for the MSP430FR5732IPW is 16 MHz, as specified in the datasheet. However, the device can also operate at lower clock frequencies, such as 1 MHz, 2 MHz, 4 MHz, and 8 MHz, depending on the application requirements.
  • The MSP430FR5732IPW can be programmed using the Texas Instruments Code Composer Studio (CCS) integrated development environment (IDE). CCS provides a comprehensive development environment for designing, debugging, and testing MSP430FR5732IPW-based applications. You can also use other programming tools, such as IAR Embedded Workbench and Keil µVision, with the MSP430FR5732IPW.
  • The MSP430FR5732IPW has 16 KB of FRAM (Ferroelectric Random Access Memory) available for data storage. FRAM is a non-volatile memory technology that provides low power consumption and fast write endurance.

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MSP430FR5732IPW Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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