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MSPM0G3507SPTR - Texas Instruments

Description: • Core – Arm® 32-bit Cortex®-M0+ CPU with memory protection unit, frequency up to 80 MHz • Operating characteristics – Extended temperature: –40°C up to 125°C – Wide supply voltage range: 1.62 V to 3.6 V • Memories – Up to 128KB of flash memory with error correction code (ECC) – Up to 32KB of SRAM with hardware parity • High-performance analog peripherals – Two simultaneous sampling 12-bit 4-Msps analog-to-digital converters (ADCs) with up to 17 external channels • 14-bit effective resolution

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MSPM0G3507SPTR - Texas Instruments PCB footprint - Quad Flat Packages - Quad Flat Packages - PT (S-PQFP-G48)
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MSPM0G3507SPTR - Texas Instruments  - 3D model - Quad Flat Packages - PT (S-PQFP-G48)
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MSPM0G3507SPTR Details

  • Manufacturer Part Number:

    MSPM0G3507SPTR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    NO

  • CPU Family:

    CORTEX-M0

  • Clock Frequency-Max:

    48 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PQFP-G48

  • JESD-609 Code:

    e4

  • Length:

    7 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    2

  • Number of DMA Channels:

    7

  • Number of I/O Lines:

    44

  • Number of Serial I/Os:

    5

  • Number of Terminals:

    48

  • Number of Timers:

    7

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP48,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    32768

  • ROM (words):

    65536

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    80 MHz

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.62 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

MSPM0G3507SPTR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the MSP430 Microcontroller Family User's Guide (SLAU144). It's essential to follow the guidelines for decoupling, signal routing, and power supply design to ensure optimal performance and minimize noise.
  • The MSPM0G3507SPTR can operate with a variety of crystal oscillators. When selecting a crystal, consider factors such as frequency tolerance, load capacitance, and ESR. Texas Instruments provides a Crystal Oscillator and Clock System (SLAA322) application report to help with crystal selection and design.
  • The MSPM0G3507SPTR has several power-saving modes, including LPM0, LPM1, LPM2, LPM3, and LPM4. Each mode offers varying levels of power reduction. To use them effectively, understand the trade-offs between power consumption and wake-up time. The MSP430 Family Power Management Module (PMM) User's Guide (SLAU144) provides detailed information on power-saving modes and how to implement them.
  • To implement a reliable and efficient USB interface, follow the guidelines in the MSP430 USB Developer's Package (SLAU208). This document provides information on USB protocol, device configuration, and firmware implementation. Additionally, use the MSP430 USB API (Application Programming Interface) to simplify USB development.
  • When designing a system with the MSPM0G3507SPTR, consider factors such as power supply design, clock system design, and electromagnetic compatibility (EMC). Ensure that your design meets the requirements for voltage, current, and temperature. Follow the guidelines in the MSP430 Hardware Design Guide (SLAU185) and the MSP430 EMC and System Design Guide (SLAU199) to ensure a robust and reliable system.

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MSPM0G3507SPTR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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