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MSPM0L1105TDGS20R - Texas Instruments

Description: ARM Microcontrollers - MCU 32-MHz Arm® Cortex®-M0+ MCU with 32-KB flash, 4-KB SRAM, 12-bit ADC 20-VSSOP -40 to 105

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MSPM0L1105TDGS20R - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGS0020A
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MSPM0L1105TDGS20R - Texas Instruments  - 3D model - Small Outline Packages - DGS0020A
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MSPM0L1105TDGS20R Details

  • Manufacturer Part Number:

    MSPM0L1105TDGS20R

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    NO

  • CPU Family:

    CORTEX-M0

  • Clock Frequency-Max:

    32 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e4

  • Length:

    5.1 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    2

  • Number of DMA Channels:

    3

  • Number of I/O Lines:

    24

  • Number of Serial I/Os:

    2

  • Number of Terminals:

    20

  • Number of Timers:

    4

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.2,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    4096

  • ROM (words):

    32768

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.1 mm

  • Speed:

    32 MHz

  • Supply Current-Max:

    2.3 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.62 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

MSPM0L1105TDGS20R Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the MSP430 Microcontroller PCB Design Guidelines document (SLAA634). Following these guidelines can help ensure optimal performance and minimize noise and EMI issues.
  • The MSPM0L1105TDGS20R requires a 32.768 kHz crystal oscillator. When selecting a crystal, consider factors such as frequency tolerance, load capacitance, and ESR. Texas Instruments provides a Crystal Oscillator and Clock System Basics application report (SLAA322) that can help with crystal selection and design.
  • The MSPM0L1105TDGS20R has an operating temperature range of -40°C to 85°C. However, the device can be operated at temperatures beyond this range with reduced performance and reliability. Consult the datasheet and Texas Instruments' Reliability and Quality webpage for more information.
  • A reliable POR circuit is critical for ensuring the device starts up correctly. Texas Instruments provides a Power-On Reset (POR) Circuit Design Guide (SLAA701) that covers POR circuit design considerations and provides example circuits.
  • When designing a power supply for the MSPM0L1105TDGS20R, consider factors such as voltage regulation, noise filtering, and decoupling. Texas Instruments provides a Power Supply Design Considerations for MSP430 Microcontrollers application report (SLAA738) that covers these topics in detail.

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MSPM0L1105TDGS20R Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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