TE Connectivity recommends a 4-layer PCB with a solid ground plane and a separate power plane for the module. The layout should also ensure minimal inductance and capacitance in the power paths.
To ensure reliability, it's essential to follow the recommended derating guidelines for temperature, voltage, and current. Additionally, ensure good thermal management, such as using a heat sink or thermal interface material, to keep the module within its operating temperature range.
The MSPM101C104 is designed to meet CISPR 22 and FCC Part 15 Class B emissions standards. To minimize EMI and RFI, use a shielded enclosure, keep cables and wires away from the module, and ensure good grounding and shielding of the PCB.
Yes, the MSPM101C104 can be used in redundant or parallel configurations to achieve higher power output or redundancy. However, it's essential to follow the recommended design guidelines and ensure proper synchronization and control of the modules.
Handle the MSPM101C104 with care to prevent damage from electrostatic discharge, physical shock, or vibration. Store the module in its original packaging, away from direct sunlight, moisture, and extreme temperatures.
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MSPM101C104 Overview
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About TE Connectivity
TE Connectivity, a global leader in connectivity and sensor solutions, designs and manufactures products that enable a more connected world. Serving a diverse range of industries, including automotive, industrial, medical, aerospace, and telecommunications, TE Connectivity offers a broad portfolio of products such as connectors, sensors, relays, and passive components. The company's innovations help improve the reliability and performance of electronic systems.
