MSRF860G - onsemi
Description: 150 C Operating Junction Temperature; Finish: All External Surfaces Corrosion Resistant and Terminal Leads Readily Solderable; Lead Temperature for Soldering Purposes: 260 C Max. for 10 Seconds; Epoxy meets UL94, VO @ 1/8"; Case: Molded Epoxy; Low Forward Voltage; Soft Recovery with Guaranteed Low Reverse Recovery Charge (QRR) and Peak Reverse Recovery Current (IRRM); Low Leakage Current; Weight: 1.9 Grams (approximately)
ECAD model is currently unavailable for this part
