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MT28EW512ABA1HPC-0SIT - Micron

Description: NOR Flash Parallel 3V/3.3V 512M-bit 64M x 8/32M x 16 100ns 64-Pin LBGA T/R/Tray

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MT28EW512ABA1HPC-0SIT - Micron PCB footprint - BGA - BGA - 64-Ball LBGA – 11mm x 13mm (Package Code: PC)
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MT28EW512ABA1HPC-0SIT - Micron  - 3D model - BGA - 64-Ball LBGA – 11mm x 13mm (Package Code: PC)
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MT28EW512ABA1HPC-0SIT Details

  • Manufacturer Part Number:

    MT28EW512ABA1HPC-0SIT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LBGA-64

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Micron Technology Inc

  • YTEOL:

    3.15

  • Access Time-Max:

    95 ns

  • Alternate Memory Width:

    8

  • JESD-30 Code:

    R-PBGA-B64

  • Length:

    13 mm

  • Memory Density:

    536870912 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Number of Words:

    33554432 words

  • Number of Words Code:

    32000000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    32MX16

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Programming Voltage:

    3 V

  • Seated Height-Max:

    1.4 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Type:

    NOR TYPE

  • Width:

    11 mm

MT28EW512ABA1HPC-0SIT Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MT28EW512ABA1HPC-0SIT is -40°C to 85°C.
  • The device should be stored in a moisture-proof bag or a dry nitrogen-filled package, and handled with an anti-static wrist strap or mat to prevent electrostatic discharge damage.
  • The recommended PCB footprint and layout for the MT28EW512ABA1HPC-0SIT can be found in the Micron Technology Inc. application note AN-225, which provides guidelines for PCB design and layout.
  • The MT28EW512ABA1HPC-0SIT supports single-bit error correction and detection using a built-in ECC (Error-Correcting Code) mechanism. The device also supports optional ECC schemes, such as BCH (Bose-Chaudhuri-Hocquenghem) or Reed-Solomon codes, which can be implemented using external logic or firmware.
  • The MT28EW512ABA1HPC-0SIT requires a specific power-up and power-down sequencing to ensure proper operation. The device should be powered up in the following sequence: VCC, then VCCQ, then clock and input signals. During power-down, the sequence should be reversed.

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MT28EW512ABA1HPC-0SIT Overview

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