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MT29F1G08ABAEAWP:E - Micron

Description: NAND Flash SLC 1G 128MX8 TSOP

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MT29F1G08ABAEAWP:E - Micron PCB footprint - Small Outline Packages - Small Outline Packages - 48-Pin TSOP
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MT29F1G08ABAEAWP:E - Micron  - 3D model - Small Outline Packages - 48-Pin TSOP
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MT29F1G08ABAEAWP:E Details

  • Manufacturer Part Number:

    MT29F1G08ABAEAWP:E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    TSOP1-48

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Micron Technology Inc

  • YTEOL:

    1

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e3

  • Length:

    18.4 mm

  • Memory Density:

    1073741824 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Number of Words:

    134217728 words

  • Number of Words Code:

    128000000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    128MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP1

  • Package Equivalence Code:

    TSSOP48,.8,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    3.3 V

  • Seated Height-Max:

    1.2 mm

  • Serial Bus Type:

    ONFI 1.0

  • Standby Current-Max:

    0.0001 A

  • Supply Current-Max:

    0.035 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Type:

    SLC NAND TYPE

  • Width:

    12 mm

  • Write Cycle Time-Max (tWC):

    0.00002 ms

  • Write Protection:

    HARDWARE

MT29F1G08ABAEAWP:E Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the MT29F1G08ABAEAWP:E is -40°C to 85°C.
  • The device requires a power-on reset (POR) sequence to ensure proper initialization. The POR sequence involves applying power to the device, waiting for the internal voltage regulator to stabilize, and then applying a reset signal to the device.
  • The MT29F1G08ABAEAWP:E supports up to 3,000 program/erase cycles.
  • The device has a built-in bad block management mechanism. The device marks bad blocks during the manufacturing process, and the host system can read the bad block information from the device. The host system is responsible for managing bad blocks during operation.
  • The typical write endurance of the MT29F1G08ABAEAWP:E is 3,000 to 5,000 write cycles per block, depending on the operating conditions and usage patterns.

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MT29F1G08ABAEAWP:E Overview

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