Part Image

MT29F4G08ABADAWP:D - Micron

Description: NAND Flash SLC 4G 512MX8 TSOP

Download MT29F4G08ABADAWP:D Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
MT29F4G08ABADAWP:D - Micron PCB footprint - Small Outline Packages - Small Outline Packages - 48-Pin TSOP – Type 1, CPL
click to zoom
3D Models
MT29F4G08ABADAWP:D - Micron  - 3D model - Small Outline Packages - 48-Pin TSOP – Type 1, CPL
click to zoom

MT29F4G08ABADAWP:D Details

  • Manufacturer Part Number:

    MT29F4G08ABADAWP:D

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    TSOP1

  • Pin Count:

    48

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Micron Technology Inc

  • YTEOL:

    1

  • Data Retention Time-Min:

    10

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e3

  • Length:

    18.4 mm

  • Memory Density:

    4294967296 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Number of Words:

    536870912 words

  • Number of Words Code:

    512000000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    512MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP1

  • Package Equivalence Code:

    TSSOP48,.8,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    3.3 V

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Standby Current-Max:

    0.0001 A

  • Supply Current-Max:

    0.035 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Type:

    SLC NAND TYPE

  • Width:

    12 mm

  • Write Cycle Time-Max (tWC):

    0.00002 ms

  • Write Protection:

    HARDWARE

MT29F4G08ABADAWP:D Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the MT29F4G08ABADAWP:D is -40°C to 85°C.
  • The POR sequence is not explicitly stated in the datasheet, but it's recommended to follow the standard power-up sequence: VCC, then VPP, then CLK, and finally CE# and WE#. Ensure that VCC and VPP are stable before applying clock and control signals.
  • The MT29F4G08ABADAWP:D supports up to 3,000 program/erase cycles per block, and up to 100,000 cycles per device.
  • The device does not have built-in bad block management. It's recommended to implement bad block management in software, using techniques such as error correction codes, checksums, and wear leveling.
  • The typical write endurance of the MT29F4G08ABADAWP:D is 3,000 to 5,000 write cycles per block, depending on the operating conditions and usage patterns.

Trust Checks

This model has been provided by an expert contributor.
Expert Contribution
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

MT29F4G08ABADAWP:D Overview

Use the download button to access the MT29F4G08ABADAWP:D schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MT29F, or try a keyword search, such as Flash Memories

Parts related to MT29F4G08ABADAWP:D

Showing 0 results