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MT29F8G01ADAFD12-AAT:F - Micron

Description: NAND Flash SLC 8G 8GX1 TBGA DDP

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PCB Footprints
MT29F8G01ADAFD12-AAT:F - Micron PCB footprint - BGA - BGA - 24-Pin T-PBGA (5 x 5 Ball Grid Array) 6mm x 8mm – Package Code: 12
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MT29F8G01ADAFD12-AAT:F - Micron  - 3D model - BGA - 24-Pin T-PBGA (5 x 5 Ball Grid Array) 6mm x 8mm – Package Code: 12
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MT29F8G01ADAFD12-AAT:F Details

  • Manufacturer Part Number:

    MT29F8G01ADAFD12-AAT:F

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TBGA-24

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Micron Technology Inc

  • YTEOL:

    7

  • Clock Frequency-Max (fCLK):

    133 MHz

  • Data Retention Time-Min:

    10

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PBGA-B24

  • Length:

    8 mm

  • Memory Density:

    8589934592 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Number of Words:

    1073741824 words

  • Number of Words Code:

    1000000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1GX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TBGA

  • Package Equivalence Code:

    BGA24,5X5,40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    3.3 V

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.2 mm

  • Serial Bus Type:

    SPI

  • Standby Current-Max:

    0.00005 A

  • Supply Current-Max:

    0.035 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Type:

    SLC NAND TYPE

  • Width:

    6 mm

  • Write Protection:

    HARDWARE/SOFTWARE

MT29F8G01ADAFD12-AAT:F Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MT29F8G01ADAFD12-AAT:F is -40°C to 85°C.
  • The MT29F8G01ADAFD12-AAT:F has an internal power-on reset circuit that initializes the device after power-up. No external reset circuit is required.
  • The MT29F8G01ADAFD12-AAT:F has a minimum write endurance of 3,000 cycles per block, with a maximum of 100,000 cycles per device.
  • The MT29F8G01ADAFD12-AAT:F has a bad block management system that detects and marks bad blocks. The host system should implement a bad block management algorithm to handle bad blocks.
  • The MT29F8G01ADAFD12-AAT:F supports both chip erase and block erase commands. The recommended method is to use the block erase command to erase specific blocks.

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MT29F8G01ADAFD12-AAT:F Overview

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