MT29F8G08ABBCAH4-IT:C - Micron

MT29F8G08ABBCAH4-IT:C Details

• Manufacturer Part Number:

  MT29F8G08ABBCAH4-IT:C

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.51

• Manufacturer:

  Micron Technology Inc

• YTEOL:

  6

• Access Time-Max:

  30 ns

• Command User Interface:

  YES

• Data Polling:

  NO

• JESD-30 Code:

  R-PBGA-B63

• Memory Density:

  8589934592 bit

• Memory IC Type:

  FLASH

• Memory Width:

  8

• Number of Sectors/Size:

  4K

• Number of Terminals:

  63

• Number of Words:

  1073741824 words

• Number of Words Code:

  1000000000

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  1GX8

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  FBGA

• Package Equivalence Code:

  BGA63,10X12,32

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, FINE PITCH

• Page Size:

  4K words

• Parallel/Serial:

  PARALLEL

• Peak Reflow Temperature (Cel):

  NOT SPECIFIED

• Programming Voltage:

  1.8 V

• Qualification Status:

  Not Qualified

• Ready/Busy:

  YES

• Sector Size:

  256K

• Standby Current-Max:

  0.00005 A

• Supply Current-Max:

  0.02 mA

• Supply Voltage-Nom (Vsup):

  1.8 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  NOT SPECIFIED

• Toggle Bit:

  NO

• Type:

  SLC NAND TYPE