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MT29GZ6A6BPIET-046AAT.112 - Micron

Description: Multichip Packages MASSFLASH/LPDDR4 16G NM112

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MT29GZ6A6BPIET-046AAT.112 - Micron PCB footprint - BGA - BGA - 149-Ball VFBGA
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MT29GZ6A6BPIET-046AAT.112 - Micron  - 3D model - BGA - 149-Ball VFBGA
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MT29GZ6A6BPIET-046AAT.112 Details

  • Manufacturer Part Number:

    MT29GZ6A6BPIET-046AAT.112

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    VFBGA-149

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Micron Technology Inc

  • Access Time-Max:

    3.5 ns

  • JESD-30 Code:

    R-PBGA-B149

  • Length:

    9.5 mm

  • Memory Density:

    8589934592 bit

  • Memory IC Type:

    MEMORY CIRCUIT

  • Memory Width:

    16

  • Mixed Memory Type:

    FLASH+LPDDR

  • Number of Functions:

    1

  • Number of Terminals:

    149

  • Number of Words:

    536870912 words

  • Number of Words Code:

    512000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    512MX16

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA149,14X16,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    1.95 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Width:

    8 mm

MT29GZ6A6BPIET-046AAT.112 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for MT29GZ6A6BPIET-046AAT.112 is -40°C to 85°C.
  • The power-up sequence should follow the recommended power-up sequence in the datasheet, and power-down sequence should be done in the reverse order. It's also important to ensure that VCC is stable before applying clock signals.
  • The recommended PCB layout and design considerations include using a 4-layer PCB, keeping signal traces short and away from noise sources, and using decoupling capacitors to reduce power noise.
  • Error correction and detection mechanisms such as ECC (Error-Correcting Code) and CRC (Cyclic Redundancy Check) can be implemented using external logic or through software algorithms.
  • The specific timing requirements for the device's clock signals include a clock frequency of 166 MHz, a clock rise time of 1 ns, and a clock fall time of 1 ns.

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MT29GZ6A6BPIET-046AAT.112 Overview

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