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MT40A4G4SA-062E:F - Micron

Description: VDD = VDDQ = 1.2V ά60mV On-die, internal, adjustable VREFDQ generation 1.2V pseudo open-drain I/O TC maximum up to 95ιC 64ms, 8192-cycle refresh up to 85ιC 32ms, 8192-cycle refresh at >85ιC to 95ιC 16 internal banks (x4, x8): 4 groups of 4 banks each 8 internal banks (x16): 2 groups of 4 banks each 8n-bit prefetch architecture Programmable data strobe preambles Data strobe preamble training Command/Address latency (CAL) Multipurpose register READ and WRITE capability

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PCB Footprints
MT40A4G4SA-062E:F - Micron PCB footprint - BGA - BGA - 78-ball 7.5mma x 11.0mm FBGAs.
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3D Models
MT40A4G4SA-062E:F - Micron  - 3D model - BGA - 78-ball 7.5mma x 11.0mm FBGAs.
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MT40A4G4SA-062E:F Details

  • Manufacturer Part Number:

    MT40A4G4SA-062E:F

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    FBGA-78

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.36

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Micron Technology Inc

  • YTEOL:

    0

  • Access Mode:

    MULTI BANK PAGE BURST

  • Additional Feature:

    AUTO/SELF REFRESH

  • Clock Frequency-Max (fCLK):

    1600 MHz

  • I/O Type:

    COMMON

  • Interleaved Burst Length:

    4,8

  • JESD-30 Code:

    R-PBGA-B78

  • Length:

    11 mm

  • Memory Density:

    17179869184 bit

  • Memory IC Type:

    DDR4 DRAM

  • Memory Width:

    4

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    78

  • Number of Words:

    4294967296 words

  • Number of Words Code:

    4000000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    95 °C

  • Organization:

    4GX4

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA78,9X13,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Refresh Cycles:

    8192

  • Seated Height-Max:

    1.2 mm

  • Self Refresh:

    YES

  • Sequential Burst Length:

    4,8

  • Standby Current-Max:

    0.06 A

  • Supply Current-Max:

    0.27 mA

  • Supply Voltage-Max (Vsup):

    1.26 V

  • Supply Voltage-Min (Vsup):

    1.14 V

  • Supply Voltage-Nom (Vsup):

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    7.5 mm

MT40A4G4SA-062E:F Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MT40A4G4SA-062E:F is 0°C to 85°C, with a storage temperature range of -40°C to 100°C.
  • To ensure signal integrity on the address and command bus, it is recommended to use a controlled impedance PCB design, keep the signal traces short and matched, and use a termination scheme such as ODT (On-Die Termination) or RTT (Registered Terminated Transmission Line).
  • The recommended refresh rate for the MT40A4G4SA-062E:F is 8192 refreshes per second, with a refresh interval of 7.8us.
  • The MT40A4G4SA-062E:F is designed to operate at a voltage supply of 1.2V, but it can also operate at a voltage supply of 1.35V with some performance degradation. However, it is not recommended to use this module with a voltage supply outside of the 1.2V to 1.35V range.
  • To handle errors and retries in your system design, it is recommended to implement an error detection and correction mechanism, such as ECC (Error-Correcting Code) or CRC (Cyclic Redundancy Check), and to design a retry mechanism that can handle errors and timeouts.

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MT40A4G4SA-062E:F Overview

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