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MT41K256M16HA-125:E - Micron

Description: SDRAM TFBGA-96 RoHS

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MT41K256M16HA-125:E - Micron PCB footprint - BGA - BGA - 96-Ball FBGA – x16 (HA)
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MT41K256M16HA-125:E - Micron  - 3D model - BGA - 96-Ball FBGA – x16 (HA)
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MT41K256M16HA-125:E Details

  • Manufacturer Part Number:

    MT41K256M16HA-125:E

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    FBGA-96

  • Pin Count:

    96

  • Direct Group:

    ME0117981KP1

  • Similar Group:

    ME011019124510541290

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.36

  • Manufacturer:

    Micron Technology Inc

  • YTEOL:

    0

  • Access Mode:

    MULTI BANK PAGE BURST

  • Additional Feature:

    AUTO/SELF REFRESH

  • Clock Frequency-Max (fCLK):

    800 MHz

  • I/O Type:

    COMMON

  • Interleaved Burst Length:

    8

  • JESD-30 Code:

    R-PBGA-B96

  • JESD-609 Code:

    e1

  • Length:

    14 mm

  • Memory Density:

    4294967296 bit

  • Memory IC Type:

    DDR3L DRAM

  • Memory Width:

    16

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    96

  • Number of Words:

    268435456 words

  • Number of Words Code:

    256000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    95 °C

  • Organization:

    256MX16

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA96,9X16,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Refresh Cycles:

    8192

  • Seated Height-Max:

    1.2 mm

  • Self Refresh:

    YES

  • Sequential Burst Length:

    8

  • Standby Current-Max:

    0.016 A

  • Supply Current-Max:

    0.243 mA

  • Supply Voltage-Max (Vsup):

    1.45 V

  • Supply Voltage-Min (Vsup):

    1.283 V

  • Supply Voltage-Nom (Vsup):

    1.35 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    9 mm

MT41K256M16HA-125:E Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MT41K256M16HA-125:E is 0°C to 95°C, with a storage temperature range of -40°C to 100°C.
  • To ensure signal integrity, use a signal integrity analysis tool to simulate the signal behavior and optimize the PCB design. Additionally, use a termination scheme such as ODT (On-Die Termination) or series termination to reduce signal reflections.
  • The recommended voltage for the VDD and VDDQ power supplies is 1.2V ± 0.06V.
  • The MT41K256M16HA-125:E module requires a refresh command every 64ms (tREFI) to maintain data integrity. The refresh command should be issued during the self-refresh mode.
  • The MT41K256M16HA-125:E module supports a maximum clock frequency of 1600MHz.

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MT41K256M16HA-125:E Overview

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Image Part Number Model
Part Image MT41K256M16HA-125AIT:E Micron Technology Inc

DDR3L DRAM, 256MX16, CMOS, PBGA96

Part Image MT41K256M16HA-125XIT Micron Technology Inc

DDR3L DRAM, 256MX16, CMOS, PBGA96

Part Image MT41K256M16HA-125XIT:E Micron Technology Inc

DDR3L DRAM, 256MX16, CMOS, PBGA96

Part Image MT41K256M16HA-125M:E Micron Technology Inc

DDR3L DRAM, 256MX16, 0.225ns, CMOS, PBGA96

Part Image MT41K256M16HA-125AIT Micron Technology Inc

DDR3L DRAM, 256MX16, CMOS, PBGA96

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