MT53E256M32D2FW-046AUT:B - Micron

MT53E256M32D2FW-046AUT:B Details

• Manufacturer Part Number:

  MT53E256M32D2FW-046AUT:B

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  TFBGA-200

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.36

• Manufacturer:

  Micron Technology Inc

• YTEOL:

  5

• Access Mode:

  MULTI BANK PAGE BURST

• Additional Feature:

  SELF REFRESH, IT ALSO REQUIRES 1.8V NOMINAL SUPPLY, TERM PITCH-MAX

• Clock Frequency-Max (fCLK):

  2133 MHz

• I/O Type:

  COMMON

• Interleaved Burst Length:

  16,32

• JESD-30 Code:

  R-PBGA-B200

• JESD-609 Code:

  e1

• Length:

  14.5 mm

• Memory Density:

  8589934592 bit

• Memory IC Type:

  LPDDR4 DRAM

• Memory Width:

  32

• Number of Functions:

  1

• Number of Ports:

  1

• Number of Terminals:

  200

• Number of Words:

  268435456 words

• Number of Words Code:

  256000000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  256MX32

• Output Characteristics:

  3-STATE

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TFBGA

• Package Equivalence Code:

  BGA200,12X22,32/25

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, THIN PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Refresh Cycles:

  8192

• Screening Level:

  AEC-Q100

• Seated Height-Max:

  1.1 mm

• Self Refresh:

  YES

• Sequential Burst Length:

  16,32

• Supply Voltage-Max (Vsup):

  1.17 V

• Supply Voltage-Min (Vsup):

  1.06 V

• Supply Voltage-Nom (Vsup):

  1.1 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  10 mm