MT55L256L36PB-6 - Micron

MT55L256L36PB-6 Details

• Manufacturer Part Number:

  MT55L256L36PB-6

• Part Life Cycle Code:

  Transferred

• Part Package Code:

  BGA

• Package Description:

  14 X 22 MM, PLASTIC, MS-028BHA, BGA-119

• Pin Count:

  119

• ECCN Code:

  3A991.b.2.a

• HTS Code:

  8542.32.00.41

• Manufacturer:

  Micron Technology Inc

• Access Time-Max:

  3.5 ns

• I/O Type:

  COMMON

• JESD-30 Code:

  R-PBGA-B119

• JESD-609 Code:

  e0

• Length:

  22 mm

• Memory Density:

  9437184 bit

• Memory IC Type:

  ZBT SRAM

• Memory Width:

  36

• Number of Functions:

  1

• Number of Terminals:

  119

• Number of Words:

  262144 words

• Number of Words Code:

  256000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  70 °C

• Organization:

  256KX36

• Output Characteristics:

  3-STATE

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  BGA

• Package Equivalence Code:

  BGA119,7X17,50

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY

• Parallel/Serial:

  PARALLEL

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  2.4 mm

• Standby Current-Max:

  0.01 A

• Standby Voltage-Min:

  3.14 V

• Supply Current-Max:

  0.5 mA

• Supply Voltage-Max (Vsup):

  3.465 V

• Supply Voltage-Min (Vsup):

  3.135 V

• Supply Voltage-Nom (Vsup):

  3.3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  COMMERCIAL

• Terminal Finish:

  Tin/Lead (Sn/Pb)

• Terminal Form:

  BALL

• Terminal Pitch:

  1.27 mm

• Terminal Position:

  BOTTOM

• Width:

  14 mm