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MT8888CSR1 - Microsemi Corporation

Description: Telecom Interface ICs Pb Free DTMF RECEIVER

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MT8888CSR1 - Microsemi Corporation PCB footprint - Small Outline Packages - Small Outline Packages - MT8888CSR1
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MT8888CSR1 Details

  • Manufacturer Part Number:

    MT8888CSR1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Part Package Code:

    SOIC

  • Package Description:

    0.300 INCH, LEAD FREE, MS-013AC, SOIC-20

  • Pin Count:

    20

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    12.8 mm

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP20,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Supply Current-Max:

    11 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Telecom IC Type:

    DTMF SIGNALING CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    7.5 mm

MT8888CSR1 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital sections separate, and use a star topology for the power supply connections.
  • Follow the power-up sequence outlined in the datasheet, and ensure that the VCC and VDD pins are powered up simultaneously. Also, configure the device using the recommended register settings and clock frequencies.
  • Ensure good airflow around the device, and use a heat sink if necessary. Keep the device away from heat sources, and avoid blocking the airflow vents on the package.
  • Use the built-in diagnostic features, such as the error detection and correction mechanisms. Also, check the device's configuration and register settings, and verify that the power supply and clock signals are stable and within specifications.
  • Yes, follow good EMI/EMC design practices, such as using shielding, filtering, and grounding techniques. Also, ensure that the device is placed away from noise sources and antennas.

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