MTC3028S28 - XP POWER

MTC3028S28 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  XP Power recommends a PCB layout with a large copper area connected to the module's thermal pad to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended, and the copper area should be at least 1 inch x 1 inch in size.
• Can I use the MTC3028S28 in a high-vibration environment?
  Yes, the MTC3028S28 is designed to withstand high-vibration environments. It has been tested to meet the IEC 60068-2-6 standard for vibration resistance. However, it's recommended to follow proper mounting and screw torque procedures to ensure the module remains securely attached to the PCB.
• How do I ensure the module's input fuse is properly sized?
  The input fuse should be sized based on the module's maximum input current rating, which is 28A for the MTC3028S28. A fuse with a rating of 30A or higher is recommended to ensure the module operates within its specified input current range.
• What is the recommended input capacitor value and type for the MTC3028S28?
  XP Power recommends using a low-ESR input capacitor with a value of 10uF to 22uF, and a voltage rating of at least 50V. A ceramic or film capacitor is recommended due to their low ESR and high reliability.
• Can I use the MTC3028S28 in a redundant or parallel configuration?
  Yes, the MTC3028S28 can be used in a redundant or parallel configuration to achieve higher power output or redundancy. However, it's essential to follow XP Power's guidelines for parallel and redundant operation to ensure proper functionality and reliability.