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MTCH1060-I/REB - Microchip

Description: Touch Screen Controllers 6 channel touch controller, GPIO, UART tuning

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MTCH1060-I/REB - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 20-Lead Very Thin Plastic Quad Flat, No Lead Package (REB) - 3x3 mm Body [VQFN] With 1.7 mm Exposed Pad
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MTCH1060-I/REB - Microchip  - 3D model - Quad Flat No-Lead - 20-Lead Very Thin Plastic Quad Flat, No Lead Package (REB) - 3x3 mm Body [VQFN] With 1.7 mm Exposed Pad
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for MTCH1060-I/REB
  • Part Number MTCH1060-I/REB
  • Manufacturer Microchip
  • Pin Count 21
  • Part Category Integrated Circuit
  • Package Category Quad Flat No-Lead
  • Footprint Name Quad Flat No-Lead - 20-Lead Very Thin Plastic Quad Flat, No Lead Package (REB) - 3x3 mm Body [VQFN] With 1.7 mm Exposed Pad
  • Released Date Apr 10, 2025
  • Last Modified Date Apr 10, 2025 4:15 AM UTC
  • Pinout / Pin List Click Here (Member Only)

MTCH1060-I/REB Details

  • Manufacturer Part Number:

    MTCH1060-I/REB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    VQFN-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    VQFN-20

  • Country Of Origin:

    Philippines, Thailand

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    3 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    24

  • JESD-30 Code:

    S-PQCC-N20

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC20,.12SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Width:

    3 mm

  • uPs/uCs/Peripheral ICs Type:

    CAPACITIVE TOUCH SCREEN CONTROLLERS

MTCH1060-I/REB Frequently Asked Questions (FAQs)

  • Microchip provides a recommended PCB layout in the MTCH1060-I/REB datasheet, but it's essential to follow good PCB design practices, such as using a solid ground plane, minimizing signal trace lengths, and using decoupling capacitors to reduce noise and EMI.
  • The MTCH1060-I/REB can be configured for I2C or SPI communication through the MODE pin. For I2C, connect the MODE pin to VDD, and for SPI, connect it to GND. Additionally, ensure the correct pin connections and configuration for the chosen communication protocol.
  • The MTCH1060-I/REB can operate up to 400 kHz in I2C mode and up to 10 MHz in SPI mode. However, the actual operating frequency may be limited by the system design, noise, and other environmental factors.
  • The MTCH1060-I/REB has built-in POR and BOR features to ensure reliable operation. During power-up, the device will reset when the supply voltage reaches the POR threshold (typically 1.8V). The BOR feature will reset the device if the supply voltage drops below the BOR threshold (typically 1.7V). Ensure that your system design accommodates these features to prevent unexpected resets.
  • To minimize noise and ensure reliable operation, it's recommended to use a 0.1 μF ceramic capacitor and a 10 μF electrolytic capacitor in parallel, connected between the VDD pin and GND. This will help filter out high-frequency noise and provide a stable power supply.

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MTCH1060-I/REB Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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