MTFC16GAPALBH-AAT - Micron

MTFC16GAPALBH-AAT Details

• Manufacturer Part Number:

  MTFC16GAPALBH-AAT

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Package Description:

  TFBGA-153

• Country Of Origin:

  Malaysia, Singapore

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.51

• Factory Lead Time:

  26 Weeks

• Date Of Intro:

  2018-11-26

• Manufacturer:

  Micron Technology Inc

• YTEOL:

  0

• Clock Frequency-Max (fCLK):

  200 MHz

• Command User Interface:

  NO

• Data Polling:

  NO

• JESD-30 Code:

  R-PBGA-B153

• JESD-609 Code:

  e1

• Length:

  13 mm

• Memory Density:

  137438953472 bit

• Memory IC Type:

  FLASH

• Memory Width:

  8

• Number of Functions:

  1

• Number of Terminals:

  153

• Number of Words:

  17179869184 words

• Number of Words Code:

  16000000000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  105 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  16GX8

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TFBGA

• Package Equivalence Code:

  BGA153,14X14,20

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, THIN PROFILE, FINE PITCH

• Parallel/Serial:

  PARALLEL

• Peak Reflow Temperature (Cel):

  260

• Programming Voltage:

  2.7 V

• Ready/Busy:

  YES

• Seated Height-Max:

  1.2 mm

• Supply Voltage-Max (Vsup):

  3.6 V

• Supply Voltage-Min (Vsup):

  2.7 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  TIN SILVER COPPER

• Terminal Form:

  BALL

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Toggle Bit:

  NO

• Type:

  NAND TYPE

• Width:

  11.5 mm

• Write Protection:

  HARDWARE