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MTFC16GJDEC-4MIT - Micron

Description: 169-Ball WFBGA – 14.0mm x 18.00mm x 0.8mm (Package Code: EC)

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MTFC16GJDEC-4MIT - Micron PCB footprint - BGA - BGA - 169-Ball WFBGA – 14.0mm x 18.00mm x 0.8mm (Package Code: EC)
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MTFC16GJDEC-4MIT - Micron  - 3D model - BGA - 169-Ball WFBGA – 14.0mm x 18.00mm x 0.8mm (Package Code: EC)
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MTFC16GJDEC-4MIT Details

  • Manufacturer Part Number:

    MTFC16GJDEC-4MIT

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    WFBGA-169

  • Pin Count:

    169

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Micron Technology Inc

  • YTEOL:

    0

  • Clock Frequency-Max (fCLK):

    52 MHz

  • JESD-30 Code:

    R-PBGA-B169

  • JESD-609 Code:

    e1

  • Length:

    18 mm

  • Memory Density:

    137438953472 bit

  • Memory IC Type:

    FLASH CARD

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    169

  • Number of Words:

    17179869184 words

  • Number of Words Code:

    16000000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    16GX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA169,14X28,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Parallel/Serial:

    PARALLEL

  • Programming Voltage:

    3.3 V

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Type:

    MLC NAND TYPE

  • Width:

    14 mm

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