Part Image

MTFC32GAPALBH-AIT - Micron

Description: FLASH - NAND Memory IC 256Gbit MMC 153-TFBGA (11.5x13)

Download MTFC32GAPALBH-AIT Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
MTFC32GAPALBH-AIT - Micron PCB footprint - BGA - BGA - 153-Ball TFBGA – 11.5mm x 13.0mm x 1.1mm (Package Code BH)
click to zoom
3D Models
MTFC32GAPALBH-AIT - Micron  - 3D model - BGA - 153-Ball TFBGA – 11.5mm x 13.0mm x 1.1mm (Package Code BH)
click to zoom

MTFC32GAPALBH-AIT Details

  • Manufacturer Part Number:

    MTFC32GAPALBH-AIT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TFBGA-153

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Date Of Intro:

    2018-11-26

  • Manufacturer:

    Micron Technology Inc

  • YTEOL:

    0

  • JESD-30 Code:

    R-PBGA-B153

  • JESD-609 Code:

    e1

  • Length:

    13 mm

  • Memory Density:

    274877906944 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    153

  • Number of Words:

    34359738368 words

  • Number of Words Code:

    32000000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    32GX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    2.7 V

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    11.5 mm

MTFC32GAPALBH-AIT Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for MTFC32GAPALBH-AIT is -40°C to 85°C.
  • Handle the device by the edges to prevent damage to the internal components. Use a static-safe environment and follow the recommended soldering profile to prevent thermal damage.
  • The MTFC32GAPALBH-AIT supports up to 3,000 erase cycles per block.
  • The optimal timing for read and write operations depends on the specific application and system design. Refer to the datasheet for recommended timing parameters and consult with Micron's technical support team for customized guidance.
  • The MTFC32GAPALBH-AIT has an active current of 10mA (typical) and a standby current of 10uA (typical). Refer to the datasheet for detailed power consumption characteristics.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

MTFC32GAPALBH-AIT Overview

Use the download button to access the MTFC32GAPALBH-AIT schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MTFC3, or try a keyword search, such as Flash Memories

Parts related to MTFC32GAPALBH-AIT

Showing 0 results