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MTFC32GAPALNA-AIT - Micron

Description: e.MMC Memory

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PCB Footprints
MTFC32GAPALNA-AIT - Micron PCB footprint - BGA - BGA - 100-Ball TBGA – 14mm x 18mm x 1.2mm
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3D Models
MTFC32GAPALNA-AIT - Micron  - 3D model - BGA - 100-Ball TBGA – 14mm x 18mm x 1.2mm
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MTFC32GAPALNA-AIT Details

  • Manufacturer Part Number:

    MTFC32GAPALNA-AIT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TBGA-100

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Date Of Intro:

    2018-11-26

  • Manufacturer:

    Micron Technology Inc

  • YTEOL:

    0

  • Clock Frequency-Max (fCLK):

    200 MHz

  • Command User Interface:

    NO

  • Data Polling:

    NO

  • JESD-30 Code:

    R-PBGA-B100

  • JESD-609 Code:

    e1

  • Length:

    18 mm

  • Memory Density:

    274877906944 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    100

  • Number of Words:

    34359738368 words

  • Number of Words Code:

    32000000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    32GX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TBGA

  • Package Equivalence Code:

    BGA100,10X15,40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    2.7 V

  • Ready/Busy:

    YES

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Toggle Bit:

    NO

  • Type:

    NAND TYPE

  • Width:

    14 mm

  • Write Protection:

    HARDWARE

MTFC32GAPALNA-AIT Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for MTFC32GAPALNA-AIT is -40°C to 85°C.
  • Handle the device by the edges to prevent damage to the internal components. Use a static-safe environment and follow the recommended soldering profile to prevent thermal damage.
  • The MTFC32GAPALNA-AIT supports up to 3,000 erase cycles per block.
  • Implement a power-fail interrupt (PFI) or a voltage detector to detect power failures and prevent data corruption. Also, use a capacitor or a battery backup to maintain power to the device during power failures.
  • Store the device in a moisture-proof bag or a vacuum-sealed package to prevent moisture absorption. Handle the device in a static-safe environment and avoid bending or flexing the package.

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