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MTS62C19A-HS105 - Microchip

Description: Motor / Motion / Ignition Controllers & Drivers Dual Full-Bridge PWM Motor Driver

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MTS62C19A-HS105 - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - SOP 24L
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MTS62C19A-HS105 - Microchip  - 3D model - Small Outline Packages - SOP 24L
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MTS62C19A-HS105 Details

  • Manufacturer Part Number:

    MTS62C19A-HS105

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    SOIC-24

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    28 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Additional Feature:

    ALSO REQUIRED LOAD SUPPLY VOLTAGE OF 10V TO 40V

  • Analog IC - Other Type:

    STEPPER MOTOR CONTROLLER

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e3

  • Length:

    15.697 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP24,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    2.642 mm

  • Supply Current-Max (Isup):

    1 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7.518 mm

MTS62C19A-HS105 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from noise sources. Use a common mode filter or a ferrite bead to reduce EMI.
  • Use a thermal management strategy such as heat sinks, thermal interfaces, or thermal vias to keep the junction temperature below 125°C. Ensure good airflow and avoid thermal hotspots.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input/output pins. Ensure that the PCB layout and component placement minimize the risk of ESD damage.
  • Use the device's low-power modes, such as sleep or standby, to reduce power consumption. Optimize the system's power management strategy to minimize power consumption during idle periods.
  • Use a metal shield or a Faraday cage to reduce electromagnetic radiation. Ensure that the PCB layout and component placement minimize electromagnetic interference (EMI).

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MTS62C19A-HS105 Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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