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MUN5233DW1T1G - onsemi

Description: Simplifies Circuit Design; Reduces Board Space; Reduces Component Count; S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant

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MUN5233DW1T1G - onsemi - PCB symbol
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PCB Footprints
MUN5233DW1T1G - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - sot-363
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3D Models
MUN5233DW1T1G - onsemi - 3D model - SOT23 (6-Pin) - sot-363
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MUN5233DW1T1G Details

  • Manufacturer Part Number:

    MUN5233DW1T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-88/SC70-6/SOT-363 6 LEAD

  • Pin Count:

    6

  • Manufacturer Package Code:

    419B-02

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Additional Feature:

    BUILT-IN BIAS RESISTOR RATIO IS 10

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    80

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.385 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

MUN5233DW1T1G Frequently Asked Questions (FAQs)

  • A 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer is recommended. This helps to dissipate heat efficiently and reduces thermal resistance.
  • Ensure that the device is operated within the recommended temperature range (−40°C to +150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, consider derating the device's power handling at high temperatures.
  • A reflow soldering profile with a peak temperature of 260°C and a dwell time of 20-30 seconds is recommended. Avoid exceeding 280°C to prevent damage to the device.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins. Ensure that the ESD protection devices are rated for the maximum voltage and current of the application.
  • Store the device in a dry, cool place away from direct sunlight. Handle the device by the body, avoiding touching the leads or pins. Use anti-static packaging and handling materials to prevent ESD damage.

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MUN5233DW1T1G Overview

Use the download button to access the MUN5233DW1T1G schematic symbol, PCB footprint, and 3D model.
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MUN5233DW1T1G Alternates

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For a full list of alternate parts for MUN5233DW1T1G, check out Findchips.com