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MUN5235DW1T1G - onsemi

Description: Dual NPN Transistors; SC-88 (SOT-363) Package; NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101; These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant

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PCB Footprints
MUN5235DW1T1G - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SOT−363-6
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3D Models
MUN5235DW1T1G - onsemi  - 3D model - SOT23 (6-Pin) - SOT−363-6
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MUN5235DW1T1G Details

  • Manufacturer Part Number:

    MUN5235DW1T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-88/SC70-6/SOT-363 6 LEAD

  • Package Description:

    SC-88, SC-70, SOT-363, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    419B-02

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    80

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.385 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

  • VCEsat-Max:

    0.25 V

MUN5235DW1T1G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the thermal pad of the MUN5235DW1T1G to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, ensure good thermal design, use a heat sink if necessary, and consider derating the device's power handling at high temperatures.
  • The MUN5235DW1T1G has built-in ESD protection, but it's still recommended to follow standard ESD handling precautions during assembly and handling. This includes using an ESD wrist strap or mat, and storing the devices in anti-static packaging.
  • Yes, the MUN5235DW1T1G is suitable for high-reliability and automotive applications. It's AEC-Q101 qualified, which means it meets the stringent requirements for automotive applications. However, it's essential to follow the recommended operating conditions and to consult with onsemi's application engineers for specific guidance.
  • To troubleshoot issues with the MUN5235DW1T1G, start by checking the device's operating conditions, including voltage, current, and temperature. Verify that the device is used within its recommended operating conditions. Use oscilloscopes or logic analyzers to monitor the device's inputs and outputs. Consult onsemi's application notes and technical support resources for guidance.

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MUN5235DW1T1G Overview

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