HALOGEN FREE AND ROHS COMPLIANT, CASE 419B-02, SC-88, SC-70, 6 PIN
Pin Count:
6
Manufacturer Package Code:
419B-02
Country Of Origin:
Mainland China
ECCN Code:
EAR99
Factory Lead Time:
8 Weeks
Manufacturer:
onsemi
YTEOL:
7
Additional Feature:
BUILT-IN BIAS RESISTOR RATIO 2.14
Collector Current-Max (IC):
0.1 A
Collector-Emitter Voltage-Max:
50 V
Configuration:
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR
DC Current Gain-Min (hFE):
80
JESD-30 Code:
R-PDSO-G6
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
2
Number of Terminals:
6
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-55 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
NPN AND PNP
Power Dissipation-Max (Abs):
0.385 W
Qualification Status:
Not Qualified
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
GULL WING
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON
VCEsat-Max:
0.25 V
MUN5334DW1T1G Frequently Asked Questions (FAQs)
A good PCB layout for the MUN5334DW1T1G should include a solid ground plane, wide traces for power and ground, and a thermal relief pattern under the device. A minimum of 2 oz copper thickness is recommended. Refer to onsemi's application note AND8325/D for more details.
To ensure reliable operation in high-temperature environments, ensure the device is properly heatsinked, and the junction temperature (Tj) is kept below the maximum rating of 150°C. Use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K. Monitor the device's thermal performance using the thermal resistance (RθJA) parameter.
The MUN5334DW1T1G has built-in ESD protection, but handling precautions are still necessary. Use an ESD wrist strap or mat, and handle the device by the body or leads, avoiding direct contact with the die. Store the device in an anti-static bag or tube, and follow onsemi's ESD handling guidelines.
Yes, the MUN5334DW1T1G is qualified for automotive and high-reliability applications. It meets the AEC-Q101 qualification standard, and onsemi provides a PPAP (Production Part Approval Process) documentation package for automotive customers. Contact onsemi for more information.
Follow the soldering and rework guidelines in onsemi's application note AND8326/D. Use a soldering temperature of 260°C (max) and a reflow profile with a peak temperature of 245°C (max). Avoid using wave soldering or drag soldering, and ensure the device is not exposed to temperatures above 260°C.
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MUN5334DW1T1G Overview
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