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MUR1040FCT-BP - MCC

Description: Super Fast Recovery Rectifiers

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MUR1040FCT-BP - MCC - PCB symbol
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PCB Footprints
MUR1040FCT-BP - MCC PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - ITO-220AB
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3D Models
MUR1040FCT-BP - MCC - 3D model - Transistor Outline, Vertical - ITO-220AB
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MUR1040FCT-BP Details

  • Manufacturer Part Number:

    MUR1040FCT-BP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-220AB

  • Package Description:

    3 PIN

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    5.87

  • Additional Feature:

    LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.3 V

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    80 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Output Current-Max:

    10 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    400 V

  • Reverse Current-Max:

    10 µA

  • Reverse Recovery Time-Max:

    0.05 µs

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    5

MUR1040FCT-BP Frequently Asked Questions (FAQs)

  • The recommended land pattern for MUR1040FCT-BP is a rectangular pad with a size of 2.5mm x 1.5mm, with a 0.5mm x 0.5mm thermal pad in the center. The pad should be solder-mask defined and have a non-solder-mask-defined (NSMD) pad for the thermal pad.
  • The thermal pad on the MUR1040FCT-BP should be connected to a copper plane on the PCB to dissipate heat. A thermal relief pattern can be used to connect the thermal pad to the copper plane, and a solder-mask-defined (SMD) pad should be used to prevent solder from flowing onto the thermal pad.
  • The maximum operating temperature range for MUR1040FCT-BP is -55°C to 150°C, with a storage temperature range of -55°C to 180°C.
  • Yes, the MUR1040FCT-BP is RoHS compliant, meaning it meets the European Union's Restriction of Hazardous Substances directive, which restricts the use of certain hazardous substances in electronic components.
  • The recommended soldering profile for MUR1040FCT-BP is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.

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MUR1040FCT-BP Overview

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