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MUR860-BP - MCC

Description: Super Fast Recovery Rectifiers

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PCB Footprints
MUR860-BP - MCC PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220AC
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3D Models
MUR860-BP - MCC  - 3D model - Transistor Outline, Vertical - TO-220AC
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MUR860-BP Details

  • Manufacturer Part Number:

    MUR860-BP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT, PLASTIC PACKAGE -2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    5.42

  • Application:

    GENERAL PURPOSE

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.5 V

  • JEDEC-95 Code:

    TO-220AC

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    125 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.05 µs

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    5

MUR860-BP Frequently Asked Questions (FAQs)

  • The recommended soldering temperature for the MUR860-BP is between 250°C to 260°C for a maximum of 10 seconds.
  • While the MUR860-BP is a fast-recovery diode, it's not suitable for high-frequency switching applications above 100 kHz due to its relatively high reverse recovery time (trr) of 35 ns.
  • To ensure proper heat-sinking, use a heat sink with a thermal resistance of ≤ 10°C/W and apply a thin layer of thermal interface material (TIM) between the diode and heat sink. Also, ensure the heat sink is properly mounted and secured.
  • The MUR860-BP can withstand voltage transients up to 2.5 times the rated voltage (VRRM) for a maximum duration of 10 ms.
  • Yes, you can use multiple MUR860-BP diodes in parallel to increase current handling, but ensure each diode has its own heat sink and is properly matched to minimize current imbalance.

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MUR860-BP Overview

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