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MURA105T3G - onsemi

Description: Small Compact Surface Mountable Package with J-Bend Leads; Rectangular Package for Automated Handling; High Temperature Glass Passivated Junction; Low Forward Voltage Drop (0.66 Volts Max @ 1.0 A, TJ = 150?C) Mechanical Characteristics:; Case: Epoxy, Molded; Weight: 70 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Polarity: Polarity Band Indicates Cathod

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PCB Footprints
MURA105T3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMA CASE 403D ISSUE H_1
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MURA105T3G - onsemi  - 3D model - Diodes Moulded - SMA CASE 403D ISSUE H_1
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MURA105T3G Details

  • Manufacturer Part Number:

    MURA105T3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMA

  • Package Description:

    SMA, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403D-02

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    HIGH VOLTAGE ULTRA FAST RECOVERY POWER

  • Breakdown Voltage-Min:

    50 V

  • Case Connection:

    NONE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.875 V

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    50 V

  • Reverse Current-Max:

    2 µA

  • Reverse Recovery Time-Max:

    30 µs

  • Reverse Test Voltage:

    50 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

MURA105T3G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. Multiple vias can be used to connect the thermal pad to an inner layer or the backside of the PCB for better heat dissipation.
  • The MURA105T3G requires a bias voltage of 5V to 15V. Ensure the bias voltage is stable and within the recommended range. A decoupling capacitor of 10nF to 100nF should be placed close to the device to filter out noise.
  • The maximum allowable power dissipation for the MURA105T3G is 2.5W. Ensure the device is operated within the recommended power dissipation to prevent overheating and damage.
  • Handle the device by the body or use an ESD wrist strap to prevent ESD damage. Ensure the PCB is designed with ESD protection in mind, such as using ESD protection diodes or resistors.
  • The recommended storage temperature range is -40°C to 125°C, and the recommended storage humidity range is 20% to 80% relative humidity.

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MURA105T3G Overview

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