MURA1 Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	MURA105T3G onsemi	1	Small Compact Surface Mountable Package with J-Bend Leads; Rectangular Package for Automated Handling; High Temperature Glass Passivated Junction; Low Forward Voltage Drop (0.66 Volts Max @ 1.0 A, TJ = 150?C) Mechanical Characteristics:; Case: Epoxy, Molded; Weight: 70 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Polarity: Polarity Band Indicates Cathod	Diodes Moulded	MURA105T3G	3D model available Symbol and footprint available 3	1 Download Model
	MURA160T3G onsemi	1	Small Compact Surface Mountable Package with J-Bend Leads; Rectangular Package for Automated Handling; High Temperature Glass Passivated Junction; Low Forward Voltage Drop (1.05 Volts Max @ 1.0 A, TJ = 150°C) Mechanical Characteristics:; Case: Epoxy, Molded; Weight: 70 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Shipped in 12 mm Tape and Reel, 5000 uni	Diodes Moulded	MURA160T3G	3D model available Symbol and footprint available 3	1 Download Model
	MURA120T3G onsemi	1	Small Compact Surface Mountable Package with J-Bend Leads; Rectangular Package for Automated Handling; High Temperature Glass Passivated Junction; Low Forward Voltage Drop (0.71 Volts Max @ 1.0 A, TJ = 150?C) Mechanical Characteristics:; Case: Epoxy, Molded; Weight: 70 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Shipped in 12 mm Tape and Reel, 5000 uni	Diodes Moulded	MURA120T3G	3D model available Symbol and footprint available 3	1 Download Model
	MURA140T3G onsemi	1	Small Compact Surface Mountable Package with J-Bend Leads; Rectangular Package for Automated Handling; High Temperature Glass Passivated Junction; Low Forward Voltage Drop (0.8 Volts Max @ 1.0 A, TJ = 150?C) Mechanical Characteristics:; Case: Epoxy, Molded; Weight: 70 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Shipped in 12 mm Tape and Reel, 5000 unit	Diodes Moulded	MURA140T3G	3D model available Symbol and footprint available 3	1 Download Model

	MURA110T3G onsemi	1	Small Compact Surface Mountable Package with J-Bend Leads; Rectangular Package for Automated Handling; High Temperature Glass Passivated Junction; Low Forward Voltage Drop (0.66 Volts Max @ 1.0 A, TJ = 150?C) Mechanical Characteristics:; Case: Epoxy, Molded; Weight: 70 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Polarity: Polarity Band Indicates Cathod	Diodes Moulded	MURA110T3G	3D model available Symbol and footprint available 3	1 Download Model
	MURA130T3G onsemi	1	Small Compact Surface Mountable Package with J-Bend Leads; Rectangular Package for Automated Handling; High Temperature Glass Passivated Junction; Low Forward Voltage Drop (0.8 Volts Max @ 1.0 A, TJ = 150?C) Mechanical Characteristics:; Case: Epoxy, Molded; Weight: 70 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Shipped in 12 mm Tape and Reel, 5000 unit	Diodes Moulded	MURA130T3G	3D model available Symbol and footprint available 3	1 Download Model
	MURA115T3G onsemi	1	Small Compact Surface Mountable Package with J-Bend Leads; Rectangular Package for Automated Handling; High Temperature Glass Passivated Junction; Low Forward Voltage Drop (0.71 Volts Max @ 1.0 A, TJ = 150?C) Mechanical Characteristics:; Case: Epoxy, Molded; Weight: 70 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Shipped in 12 mm Tape and Reel, 5000 uni	Diodes Moulded	MURA115T3G	3D model available Symbol and footprint available 3	1 Download Model
	MURA1J_R1_00001 PanJit Semiconductor	1	Rectifier Diode, 1 Phase, 1 Element, 1A, 600V V(RRM), Silicon, DO-214AC		MURA1J_R1_00001	3D model not available Symbol and footprint not available 0	0 Build or Request
	MURA1J_R2_00001 PanJit Semiconductor	1	Rectifier Diode, 1 Phase, 1 Element, 1A, 600V V(RRM), Silicon, DO-214AC		MURA1J_R2_00001	3D model not available Symbol and footprint not available 0	0 Build or Request
	MURA110 SUNMATE electronic Co., LTD	1	Surface mount ultrafast power rectifier diode in SMA/DO-214AC case, 50 to 600V repetitive peak reverse voltage, 1.0A average forward current, 35ns maximum reverse recovery time, glass passivated die construction.		MURA110	3D model not available Symbol and footprint not available 0	0 Build or Request
	MURA115T3G Rochester Electronics LLC	1	2 A, 150 V, SILICON, RECTIFIER DIODE, LEAD FREE, PLASTIC, CASE 403D-02, SMA , 2 PIN		MURA115T3G	3D model not available Symbol and footprint not available 0	0 Build or Request
	MURA130 SUNMATE electronic Co., LTD	1	Surface mount ultrafast power rectifier diode in SMA (DO-214AC) package, 1.0 A average forward current, 50 to 600 V repetitive peak reverse voltage, 35 ns maximum reverse recovery time, glass passivated die construction.Surface mount ultrafast power rectifier diode in SMA (DO-214AC) package, 1.0A average forward current, 50 to 600V repetitive peak reverse voltage, 35ns maximum reverse recovery time, glass passivated die construction.Surface mount ultrafast power rectifier diode in SMA/DO-214AC case, 1.0 A average forward current, 50 to 600 V repetitive peak reverse voltage, 35 ns maximum reverse recovery time, glass passivated die, solderable terminals.Surface mount ultrafast power rectifier diode in SMA/DO-214AC case, 50 to 600V repetitive peak reverse voltage, 1.0A average forward current, 35ns maximum reverse recovery time, glass passivated die construction.Surface mount ultrafast power rectifier diode in SMA (DO-214AC) package, 1.0A average forward current, 50 to 600V repetitive peak reverse voltage, glass passivated, low forward voltage drop, 35ns reverse recovery time.		MURA130	3D model not available Symbol and footprint not available 0	0 Build or Request
	MURA105T3 onsemi	1	Rectifier Diode, 1 Phase, 1 Element, 2A, 50V V(RRM), Silicon		MURA105T3	3D model not available Symbol and footprint not available 0	0 Build or Request
	MURA110 Galaxy Microelectronics	1	Rectifier Diode, 1 Phase, 1 Element, 1A, 100V V(RRM), Silicon		MURA110	3D model not available Symbol and footprint not available 0	0 Build or Request
	MURA140T3 onsemi	1	Rectifier Diode, 1 Phase, 1 Element, 2A, 400V V(RRM), Silicon		MURA140T3	3D model not available Symbol and footprint not available 0	0 Build or Request

	MURA115 SUNMATE electronic Co., LTD	1	Surface mount ultrafast power rectifier diode in SMA (DO-214AC) package, 1.0A average forward current, 50 to 600V repetitive peak reverse voltage, 35ns maximum reverse recovery time, glass passivated die construction.		MURA115	3D model not available Symbol and footprint not available 0	0 Build or Request
	MURA105 EIC Semiconductor Inc	1	Rectifier Diode,		MURA105	3D model not available Symbol and footprint not available 0	0 Build or Request
	MURA110 SynSemi Inc	1	Rectifier Diode, 1 Phase, 1 Element, 2A, 100V V(RRM), Silicon, DO-214AC		MURA110	3D model not available Symbol and footprint not available 0	0 Build or Request
	MURA160 Taitron Components Inc	1	Rectifier Diode, 1 Phase, 1 Element, 1A, 600V V(RRM), Silicon		MURA160	3D model not available Symbol and footprint not available 0	0 Build or Request
	MURA115T3 onsemi	1	Rectifier Diode, 1 Phase, 1 Element, 2A, 150V V(RRM), Silicon		MURA115T3	3D model not available Symbol and footprint not available 0	0 Build or Request
	MURA120T3 onsemi	1	Rectifier Diode, 1 Phase, 1 Element, 2A, 200V V(RRM), Silicon		MURA120T3	3D model not available Symbol and footprint not available 0	0 Build or Request
	MURA140 Taitron Components Inc	1	Rectifier Diode, 1 Phase, 1 Element, 1A, 400V V(RRM), Silicon		MURA140	3D model not available Symbol and footprint not available 0	0 Build or Request
	MURA140 SynSemi Inc	1	Rectifier Diode		MURA140	3D model not available Symbol and footprint not available 0	0 Build or Request
	MURA120 SUNMATE electronic Co., LTD	1	Surface mount ultrafast power rectifier diode in SMA (DO-214AC) package, 1.0 A average forward current, 50 to 600 V repetitive peak reverse voltage, 35 ns maximum reverse recovery time, glass passivated die construction.Surface mount ultrafast power rectifier diode in SMA (DO-214AC) package, 1.0A average forward current, 50 to 600V repetitive peak reverse voltage, 35ns maximum reverse recovery time, glass passivated die construction.		MURA120	3D model not available Symbol and footprint not available 0	0 Build or Request
	MURA105 SUNMATE electronic Co., LTD	1	Surface mount ultrafast power rectifier diode in SMA/DO-214AC case, 1.0 A average forward current, 50 to 600 V repetitive peak reverse voltage, 35 ns maximum reverse recovery time, glass passivated die, solderable terminals.		MURA105	3D model not available Symbol and footprint not available 0	0 Build or Request
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