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MURA210T3G - onsemi

Description: Small Compact Surface Mountable Package with J-Bend Leads; Rectangular Package for Automated Handling; High Temperature Glass Passivated Junction; Low Forward Voltage Drop (0.74 Volts Max @ 2.0 A, TJ = 150?C) Mechanical Characteristics:; Case: Epoxy, Molded; Weight: 70 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Shipped in 12 mm Tape and Reel, 5000 uni

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MURA210T3G - onsemi - PCB symbol
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PCB Footprints
MURA210T3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMA CASE 403D-02 ISSUE G
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MURA210T3G - onsemi - 3D model - Diodes Moulded - SMA CASE 403D-02 ISSUE G
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MURA210T3G Details

  • Manufacturer Part Number:

    MURA210T3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMA

  • Package Description:

    SMA, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403D-02

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    HIGH VOLTAGE ULTRA FAST RECOVERY POWER

  • Breakdown Voltage-Min:

    100 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.94 V

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    2 µA

  • Reverse Recovery Time-Max:

    30 µs

  • Reverse Test Voltage:

    100 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

MURA210T3G Frequently Asked Questions (FAQs)

  • A 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer is recommended. The thermal pad should be connected to the ground plane through multiple vias to ensure good heat dissipation.
  • The MURA210T3G requires a bias voltage of 5V to 15V. A stable voltage regulator and decoupling capacitors should be used to ensure a clean and stable bias voltage. Additionally, the device should be operated within the recommended operating conditions specified in the datasheet.
  • The maximum allowable power dissipation for the MURA210T3G is 2.5W. Exceeding this limit can cause the device to overheat and potentially fail. Proper thermal management and heat sinking are essential to ensure reliable operation.
  • The MURA210T3G is sensitive to ESD. Handling the device by the body or using an anti-static wrist strap can help prevent ESD damage. Additionally, using ESD-protected equipment and following proper ESD handling procedures can minimize the risk of damage.
  • The MURA210T3G should be stored in a dry, cool place away from direct sunlight. The device should be handled by the body or with anti-static materials to prevent ESD damage. Avoid bending or flexing the leads, and use a vacuum pick-up tool or tweezers to handle the device.

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MURA210T3G Overview

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