MURB1620CTG footprint, schematic symbol and 3D model by onsemi

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PCB Footprints

MURB1620CTG - onsemi PCB footprint - Other - Other - D2PAK-CASE-418B-STYLE-3

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Part Number MURB1620CTG
Manufacturer onsemi
Pin Count 3
Part Category Diode
Package Category Other
Footprint Name Other - D2PAK-CASE-418B-STYLE-3
Released Date Jan 5, 2018
Last Modified Date Sep 19, 2024 2:45 PM UTC
Pinout / Pin List Click Here (Member Only)

MURB1620CTG Details

Manufacturer Part Number:
MURB1620CTG
Brand Name:
onsemi
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Obsolete
Part Package Code:
D2PAK 2 LEAD
Pin Count:
3
Manufacturer Package Code:
418B-04
ECCN Code:
EAR99
HTS Code:
8541.10.00.80
Manufacturer:
onsemi
YTEOL:
0
Additional Feature:
FREE WHEELING DIODE
Application:
ULTRA FAST RECOVERY POWER
Breakdown Voltage-Min:
200 V
Case Connection:
CATHODE
Configuration:
COMMON CATHODE, 2 ELEMENTS
Diode Element Material:
SILICON
Diode Type:
RECTIFIER DIODE
Forward Voltage-Max (VF):
0.975 V
JESD-30 Code:
R-PSSO-G2
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Non-rep Pk Forward Current-Max:
100 A
Number of Elements:
2
Number of Phases:
1
Number of Terminals:
2
Operating Temperature-Max:
175 °C
Operating Temperature-Min:
-65 °C
Output Current-Max:
8 A
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Power Dissipation-Max:
3 W
Qualification Status:
Not Qualified
Rep Pk Reverse Voltage-Max:
200 V
Reverse Current-Max:
5 µA
Reverse Recovery Time-Max:
0.035 µs
Reverse Test Voltage:
200 V
Surface Mount:
YES
Terminal Finish:
MATTE TIN
Terminal Form:
GULL WING
Terminal Position:
SINGLE
Time@Peak Reflow Temperature-Max (s):
30

MURB1620CTG Frequently Asked Questions (FAQs)

A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. Multiple vias can be used to connect the thermal pad to an inner layer or the backside of the PCB for better heat dissipation.
Ensure that the device is operated within the recommended temperature range (up to 150°C). Use a heat sink or thermal interface material to reduce thermal resistance. Monitor the device's junction temperature to prevent overheating.
Handle the device by the body, not the leads. Avoid bending or twisting the leads. Store the device in a dry, cool place, away from direct sunlight and moisture. Use anti-static packaging and handling procedures to prevent ESD damage.
Determine the maximum current required by your application. Consider the device's current rating, voltage rating, and power dissipation. Choose a device with a current rating that exceeds the maximum current required by your application.
Ensure that each device has its own current sense resistor. Use a common gate drive signal for all devices. Implement a current sharing scheme to ensure equal current distribution among devices. Monitor the total current and adjust the current sense resistors as needed.

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MURB1620CTG Overview

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