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MURS1D-TP - MCC

Description: Super Fast Recovery Rectifiers

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PCB Footprints
MURS1D-TP - MCC PCB footprint - Diodes Moulded - Diodes Moulded - SMA (DO-214AC)
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3D Models
MURS1D-TP - MCC  - 3D model - Diodes Moulded - SMA (DO-214AC)
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MURS1D-TP Details

  • Manufacturer Part Number:

    MURS1D-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.92 V

  • JEDEC-95 Code:

    DO-214AC

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.015 µs

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

MURS1D-TP Frequently Asked Questions (FAQs)

  • The recommended land pattern for MURS1D-TP is a rectangular pad with a size of 1.3mm x 0.8mm, with a solder mask clearance of 0.1mm. It's also recommended to use a thermal relief pattern to prevent thermal stress during reflow soldering.
  • MURS1D-TP has a maximum operating temperature of 150°C, making it suitable for most industrial and commercial applications. However, it's not recommended for use in extreme high-temperature applications, such as automotive or aerospace, without proper derating and testing.
  • To ensure the reliability of MURS1D-TP in humid environments, it's recommended to use a conformal coating or potting compound to protect the device from moisture. Additionally, the device should be stored in a dry environment with a relative humidity of less than 60%.
  • The recommended soldering profile for MURS1D-TP is a peak temperature of 260°C, with a dwell time of 10-30 seconds. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
  • Yes, MURS1D-TP can be used in switching power supplies, but it's essential to ensure that the device is properly derated and the circuit is designed to minimize voltage spikes and ringing. Additionally, the device should be placed in a location that minimizes thermal stress and electromagnetic interference.

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MURS1D-TP Overview

Use the download button to access the MURS1D-TP schematic symbol, PCB footprint, and 3D model.
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For a full list of alternate parts for MURS1D-TP, check out Findchips.com