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MURS360T3G - onsemi

Description: Marking: U3D, U3G, U3J; Highly Stable Oxide Passivated Junction; Weight: 217 mg (approximately); Lead and Mounting Surface Temperature for Soldering Purposes: 260 C Max. for 10 Seconds; Polarity: Notch in Plastic Body Indicates Cathode Lead; Small Compact Surface Mountable Package with J-Bend Leads; Shipped in 16 mm Tape and Reel, 2500 units per reel; Case: Epoxy, Molded; Low Forward Voltage Drop (0.71 to 1.05 Volts Max @ 3.0 A, TJ = 150 C) Mechanical Characteristics:; Rectangular Package for Automated Hand

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MURS360T3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMC 2−LEAD CASE 403AC ISSUE A
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MURS360T3G - onsemi  - 3D model - Diodes Moulded - SMC 2−LEAD CASE 403AC ISSUE A
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MURS360T3G Details

  • Manufacturer Part Number:

    MURS360T3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMC

  • Pin Count:

    2

  • Manufacturer Package Code:

    403AC

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    HIGH VOLTAGE ULTRA FAST RECOVERY POWER

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.28 V

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    75 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    4 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    10 µA

  • Reverse Recovery Time-Max:

    0.075 µs

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

MURS360T3G Frequently Asked Questions (FAQs)

  • A 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer is recommended. This helps to dissipate heat efficiently and reduces thermal resistance.
  • Ensure that the device is operated within the recommended temperature range (up to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, consider derating the device's power handling at high temperatures.
  • A reflow soldering profile with a peak temperature of 260°C and a dwell time of 20-30 seconds is recommended. Avoid exceeding 280°C to prevent damage to the device.
  • Use ESD-safe handling and storage procedures. Ground yourself and any equipment before handling the device. Use an ESD wrist strap or mat, and store the device in an anti-static bag or container.
  • Use a wedge bonding technique with a 25-30 μm aluminum wire. Ensure the bonding temperature is below 150°C to prevent damage to the device.

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MURS360T3G Overview

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