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MURS3D-TP - MCC

Description: Super Fast Recovery Rectifiers

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Symbol
MURS3D-TP - MCC - PCB symbol
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PCB Footprints
MURS3D-TP - MCC PCB footprint - Diodes Moulded - Diodes Moulded - DO-214AB
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3D Models
MURS3D-TP - MCC - 3D model - Diodes Moulded - DO-214AB
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MURS3D-TP Details

  • Manufacturer Part Number:

    MURS3D-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • Application:

    SUPER FAST RECOVERY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.92 V

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.035 µs

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

MURS3D-TP Frequently Asked Questions (FAQs)

  • The recommended land pattern for MURS3D-TP is a rectangular pad with a size of 1.3mm x 0.8mm, with a solder mask clearance of 0.1mm. It's also recommended to use a non-solder mask defined (NSMD) pad to prevent solder from flowing onto the adjacent pads.
  • The thermal pad on the MURS3D-TP should be connected to a solid copper plane on the PCB to ensure good thermal dissipation. A thermal via or a thermal pad with a diameter of at least 1.5mm is recommended to connect the thermal pad to the copper plane.
  • The maximum operating temperature range for MURS3D-TP is -55°C to 150°C. However, the device is only guaranteed to meet its electrical specifications up to 125°C. Operation above 125°C may affect the device's reliability and lifespan.
  • Yes, MURS3D-TP is suitable for high-reliability applications. It's built with a robust design and undergoes rigorous testing to ensure its reliability. However, it's essential to follow proper design and assembly guidelines to ensure the device operates within its specifications.
  • To ensure proper soldering of MURS3D-TP, use a soldering iron with a temperature of 250°C to 260°C, and apply a solder paste with a melting point of 217°C to 220°C. The soldering process should be completed within 3-5 seconds to prevent overheating the device.

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MURS3D-TP Overview

Use the download button to access the MURS3D-TP schematic symbol, PCB footprint, and 3D model.
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