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MURS3GB-TP - MCC

Description: Super Fast Recovery Rectifiers

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PCB Footprints
MURS3GB-TP - MCC PCB footprint - Diodes Moulded - Diodes Moulded - MURS3GB-TP*
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3D Models
MURS3GB-TP - MCC  - 3D model - Diodes Moulded - MURS3GB-TP*
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MURS3GB-TP Details

  • Manufacturer Part Number:

    MURS3GB-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMB, 2 PIN

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    400 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.035 µs

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

MURS3GB-TP Frequently Asked Questions (FAQs)

  • The recommended land pattern for MURS3GB-TP is a rectangular pad with a size of 1.3mm x 0.8mm, with a solder mask clearance of 0.1mm.
  • To handle thermal considerations, ensure a good thermal connection to a heat sink or a thermal pad, and follow the recommended PCB layout guidelines to minimize thermal resistance.
  • The maximum operating temperature range for MURS3GB-TP is -55°C to 150°C, but it's recommended to operate within -40°C to 125°C for optimal performance.
  • Yes, MURS3GB-TP is suitable for high-reliability applications, but it's essential to follow the recommended derating guidelines and ensure proper thermal management.
  • To ensure reliability in a humid environment, apply a conformal coating to the PCB, and follow the recommended storage and handling guidelines to prevent moisture absorption.

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MURS3GB-TP Overview

Use the download button to access the MURS3GB-TP schematic symbol, PCB footprint, and 3D model.
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Part Image EGFM304-BS-H Formosa Microsemi Co Ltd

Rectifier Diode, 1 Phase, 1 Element, 3A, 400V V(RRM), Silicon, DO-214AA

Part Image EGFM304-BS Formosa Microsemi Co Ltd

Rectifier Diode, 1 Phase, 1 Element, 3A, 400V V(RRM), Silicon, DO-214AA

Part Image FFM304-B-H Formosa Microsemi Co Ltd

Rectifier Diode, 1 Phase, 1 Element, 3A, 400V V(RRM), Silicon, DO-214AA

Part Image ER3GB-TP-HF Micro Commercial Components

Rectifier Diode, 1 Phase, 1 Element, 3A, 400V V(RRM), Silicon, DO-214AA

Part Image HS3GBM4 Taiwan Semiconductor

Rectifier Diode, 1 Phase, 1 Element, 3A, 400V V(RRM), Silicon, DO-214AA

For a full list of alternate parts for MURS3GB-TP, check out Findchips.com