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MVF50NN151CMK40 - NXP

Description: Microprocessors - MPU A5-400, M4, GPU No Security

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Symbol
MVF50NN151CMK40 - NXP - PCB symbol
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PCB Footprints
MVF50NN151CMK40 - NXP PCB footprint - BGA - BGA - SOT1517-1
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3D Models
MVF50NN151CMK40 - NXP - 3D model - BGA - SOT1517-1
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MVF50NN151CMK40 Details

  • Manufacturer Part Number:

    MVF50NN151CMK40

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MAPBGA-364

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Has ADC:

    YES

  • Address Bus Width:

    16

  • Bit Size:

    16

  • CPU Family:

    CORTEX-A5

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    16

  • JESD-30 Code:

    S-PBGA-B364

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    131

  • Number of Terminals:

    364

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    NO

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA364,20X20,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    1572864

  • ROM Programmability:

    FLASH

  • Speed:

    400 MHz

  • Supply Current-Max:

    850 mA

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.16 V

  • Supply Voltage-Nom:

    1.23 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Gold (Ni/Au)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    17 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

MVF50NN151CMK40 Frequently Asked Questions (FAQs)

  • NXP recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
  • To ensure reliable operation at high temperatures, follow the recommended operating conditions, use a suitable thermal design, and consider derating the device's power dissipation according to the temperature derating curve provided in the datasheet.
  • The MVF50NN151CMK40 has built-in ESD protection, but it's still recommended to follow standard ESD handling precautions during assembly and testing. Additionally, consider adding external ESD protection devices if the device will be exposed to harsh environments or handling.
  • Yes, the MVF50NN151CMK40 is suitable for high-reliability and automotive applications. NXP provides additional documentation and support for these applications, including AEC-Q100 qualification and PPAP (Production Part Approval Process) support.
  • To troubleshoot issues with the internal voltage regulator, check the input voltage, output voltage, and current consumption. Ensure that the input voltage is within the recommended range, and the output voltage is within the specified tolerance. Also, verify that the device is not overheating and that the PCB layout is correct.

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MVF50NN151CMK40 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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