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MVF60NN152CMK50 - NXP

Description: Microprocessors - MPU Vybrid F 32-bit MPU, ARM Cortex-A5 core, 500 MHz, ARM Cortex-M4 core, 266 MHz, MAPBGA 364

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Symbol
MVF60NN152CMK50 - NXP - PCB symbol
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PCB Footprints
MVF60NN152CMK50 - NXP PCB footprint - BGA - BGA - SOT1517-1
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3D Models
MVF60NN152CMK50 - NXP - 3D model - BGA - SOT1517-1
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MVF60NN152CMK50 Details

  • Manufacturer Part Number:

    MVF60NN152CMK50

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-364

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5.5

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    24 MHz

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PBGA-B364

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    32

  • Number of Serial I/Os:

    7

  • Number of Terminals:

    364

  • On Chip Data RAM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA364,20X20,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (words):

    1572864

  • Seated Height-Max:

    1.5 mm

  • Speed:

    500 MHz

  • Supply Current-Max:

    850 mA

  • Supply Voltage-Max:

    1.1 V

  • Supply Voltage-Min:

    0.9 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Gold (Ni/Au)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    17 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROPROCESSOR, RISC

MVF60NN152CMK50 Frequently Asked Questions (FAQs)

  • A good PCB layout should ensure minimal thermal resistance, use thermal vias, and keep high-current paths short. A heat sink or thermal pad can be used to dissipate heat. Consult NXP's application notes for specific guidance.
  • Follow NXP's EMC guidelines, use a shielded enclosure, and implement filtering and shielding techniques. Ensure proper grounding, decoupling, and layout to minimize EMI.
  • Implement overcurrent protection using a fuse or a current-sensing resistor. Use the device's built-in fault detection features, such as overtemperature and overvoltage protection. Monitor the device's status pins to detect faults.
  • Consult NXP's application notes and reference designs for guidance on optimizing performance and efficiency. Consider factors like input voltage, output current, and switching frequency to minimize losses.
  • The device's reliability and lifespan depend on factors like operating conditions, temperature, and quality of the PCB. Consult NXP's reliability data and follow recommended usage guidelines to ensure optimal lifespan.

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MVF60NN152CMK50 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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