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MWSA0605S-330MT - SUNLORD

Description: MWSA0605S

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MWSA0605S-330MT - SUNLORD PCB footprint - Inductors Precision Moulded - Inductors Precision Moulded - MWSA0605S
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MWSA0605S-330MT - SUNLORD  - 3D model - Inductors Precision Moulded - MWSA0605S
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MWSA0605S-330MT Details

  • Manufacturer Part Number:

    MWSA0605S-330MT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    Sunlord

  • YTEOL:

    7.1

  • Case/Size Code:

    2826

  • Construction:

    Rectangular

  • Core Material:

    Wirewound

  • DC Resistance:

    0.19 Ω

  • Inductance-Nom (L):

    33 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    4.8 mm

  • Package Length:

    7 mm

  • Package Style:

    SMT

  • Package Width:

    6.6 mm

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Rated Current-Max:

    1.8 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

MWSA0605S-330MT Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MWSA0605S-330MT is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • Yes, the MWSA0605S-330MT is suitable for high-frequency applications up to 6 GHz. However, it's essential to consider the component's self-resonant frequency, which is around 3.5 GHz, and ensure that the operating frequency is below this point to avoid resonance issues.
  • During reflow soldering, the MWSA0605S-330MT should be exposed to a peak temperature of 260°C for no more than 10 seconds. The component should be placed on a solder paste layer with a thickness of 0.1mm to 0.2mm, and the reflow profile should follow the JEDEC J-STD-020 standard.
  • Yes, the MWSA0605S-330MT is compatible with lead-free soldering. The component is RoHS-compliant and can be soldered using lead-free solder alloys with a melting point above 217°C.
  • The maximum power rating of the MWSA0605S-330MT is 330mW. However, the actual power handling capability may vary depending on the operating frequency, temperature, and other environmental factors.

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MWSA0605S-330MT Overview

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