MX25R6435FBDIL0 - Macronix

MX25R6435FBDIL0 Details

• Manufacturer Part Number:

  MX25R6435FBDIL0

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  WLCSP-22

• Country Of Origin:

  Taiwan

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.51

• Factory Lead Time:

  10 Weeks

• Manufacturer:

  Macronix International Co Ltd

• YTEOL:

  6

• Clock Frequency-Max (fCLK):

  33 MHz

• Data Retention Time-Min:

  20

• Endurance:

  100000 Write/Erase Cycles

• JESD-30 Code:

  R-XBGA-B22

• JESD-609 Code:

  e1

• Memory Density:

  67108864 bit

• Memory IC Type:

  FLASH

• Memory Width:

  8

• Moisture Sensitivity Level:

  3

• Number of Functions:

  1

• Number of Terminals:

  22

• Number of Words:

  8388608 words

• Number of Words Code:

  8000000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  8MX8

• Output Characteristics:

  3-STATE

• Package Body Material:

  UNSPECIFIED

• Package Code:

  VFBGA

• Package Equivalence Code:

  BGA22(UNSPEC)

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, VERY THIN PROFILE, FINE PITCH

• Parallel/Serial:

  SERIAL

• Programming Voltage:

  1.8 V

• Seated Height-Max:

  0.52 mm

• Serial Bus Type:

  QSPI

• Standby Current-Max:

  3.5e-7 A

• Supply Current-Max:

  0.01 mA

• Supply Voltage-Max (Vsup):

  3.6 V

• Supply Voltage-Min (Vsup):

  1.65 V

• Supply Voltage-Nom (Vsup):

  1.8 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.4 mm

• Terminal Position:

  BOTTOM

• Type:

  NOR TYPE

• Write Protection:

  HARDWARE/SOFTWARE