12 X 20 MM, HALOGEN FREE AND ROHS COMPLIANT, MO-142, TSOP1-48
Country Of Origin:
Taiwan
ECCN Code:
EAR99
HTS Code:
8542.32.00.51
Factory Lead Time:
10 Weeks
Manufacturer:
Macronix International Co Ltd
YTEOL:
4
JESD-30 Code:
R-PDSO-G48
JESD-609 Code:
e3
Length:
18.4 mm
Memory Density:
1048576 bit
Memory IC Type:
FLASH
Memory Width:
8
Moisture Sensitivity Level:
3
Number of Functions:
1
Number of Terminals:
48
Number of Words:
131072 words
Number of Words Code:
128000
Operating Mode:
ASYNCHRONOUS
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Organization:
128KX8
Package Body Material:
PLASTIC/EPOXY
Package Code:
TSOP1
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE, THIN PROFILE
Parallel/Serial:
PARALLEL
Programming Voltage:
3 V
Seated Height-Max:
1.2 mm
Supply Voltage-Max (Vsup):
3.6 V
Supply Voltage-Min (Vsup):
2.7 V
Supply Voltage-Nom (Vsup):
3 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
INDUSTRIAL
Terminal Finish:
TIN
Terminal Form:
GULL WING
Terminal Pitch:
0.5 mm
Terminal Position:
DUAL
Type:
SLC NAND TYPE
Width:
12 mm
MX30LF1G18AC-TI Frequently Asked Questions (FAQs)
The MX30LF1G18AC-TI can operate in a temperature range of -40°C to 85°C.
The HOLD# signal should be asserted low to pause the current operation, and de-asserted high to resume the operation.
The WP# pin is used to prevent accidental writes to the device. When WP# is low, the device is write-protected.
The MX30LF1G18AC-TI is a 1Gb (128MB) device, organized as 2048 blocks of 64KB each.
The typical programming time for the MX30LF1G18AC-TI is 3-5ms per 256-byte page.
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MX30LF1G18AC-TI Overview
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