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MX60LF8G18AC-TI - Macronix

Description: MACRONIX - MX60LF8G18AC-TI - FLASH MEMORY, 8GBIT, -40 TO 85DEG C

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PCB Footprints
MX60LF8G18AC-TI - Macronix PCB footprint - Small Outline Packages - Small Outline Packages - TSOP (I) 48L
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MX60LF8G18AC-TI - Macronix  - 3D model - Small Outline Packages - TSOP (I) 48L
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MX60LF8G18AC-TI Details

  • Manufacturer Part Number:

    MX60LF8G18AC-TI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSOP1-48

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Macronix International Co Ltd

  • YTEOL:

    4

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e3

  • Length:

    18.4 mm

  • Memory Density:

    8589934592 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Number of Words:

    1073741824 words

  • Number of Words Code:

    1000000000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1GX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP1

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Parallel/Serial:

    PARALLEL

  • Programming Voltage:

    3 V

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Type:

    SLC NAND TYPE

  • Width:

    12 mm

MX60LF8G18AC-TI Frequently Asked Questions (FAQs)

  • The MX60LF8G18AC-TI has an operating temperature range of -40°C to 85°C.
  • The HOLD# signal should be asserted low to pause the current operation and de-asserted high to resume the operation.
  • The WP# pin is used to prevent accidental writes to the device. When WP# is low, the device is write-protected.
  • The MX60LF8G18AC-TI has a density of 8Gb (1G x 8) and is organized as 1024 blocks, each consisting of 64 pages, with 2048 bytes per page.
  • The recommended power-up sequence is to apply VCC first, followed by VPP, and then the clock signal.

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MX60LF8G18AC-TI Overview

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