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MX66L2G45GXRI00 - Macronix

Description: NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 2G-bit 2G/1G/512M x 1/2-bit/4-bit 7.5ns 24-Pin BGA

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PCB Footprints
MX66L2G45GXRI00 - Macronix PCB footprint - BGA - BGA - . 24-Ball BGA (5x5 ball array)_2021
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3D Models
MX66L2G45GXRI00 - Macronix  - 3D model - BGA - . 24-Ball BGA (5x5 ball array)_2021
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MX66L2G45GXRI00 Details

  • Manufacturer Part Number:

    MX66L2G45GXRI00

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-24

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Macronix International Co Ltd

  • YTEOL:

    9

  • Clock Frequency-Max (fCLK):

    133 MHz

  • Data Retention Time-Min:

    20

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PBGA-B24

  • Length:

    8 mm

  • Memory Density:

    2147483648 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Number of Words:

    268435456 words

  • Number of Words Code:

    256000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    256MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA24,5X5,40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Programming Voltage:

    3.3 V

  • Seated Height-Max:

    1.3 mm

  • Serial Bus Type:

    QSPI

  • Standby Current-Max:

    0.00025 A

  • Supply Current-Max:

    0.13 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Type:

    NOR TYPE

  • Width:

    6 mm

  • Write Protection:

    HARDWARE/SOFTWARE

MX66L2G45GXRI00 Frequently Asked Questions (FAQs)

  • The recommended operating voltage range for the MX66L2G45GXRI00 is 1.7V to 1.95V.
  • The POR sequence for the MX66L2G45GXRI00 involves applying power to the device, waiting for the internal POR circuit to stabilize, and then releasing the reset signal. The exact timing and sequence may vary depending on the specific application and system design.
  • The maximum operating frequency for the MX66L2G45GXRI00 is 166 MHz.
  • The boot process for the MX66L2G45GXRI00 typically involves configuring the boot mode pins, applying power, and allowing the device to execute the boot loader code from the internal ROM or external memory.
  • The MX66L2G45GXRI00 is a high-performance, low-power quad-SPI NOR flash memory device with a unique set of features, including a 1.8V to 3.6V operating voltage range, 166 MHz maximum frequency, and 2GB density. It is designed for high-reliability and low-power applications.

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