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MXD1818UR22+T - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - MXD1818UR22+T - MPU Supervisor, 1.2V-5.5V supply, Active-Low, Open-Drain, 150 ms delay/2.18V threshold, SOT-23-3

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MXD1818UR22+T - Analog Devices PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - U3+1
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3D Models
MXD1818UR22+T - Analog Devices  - 3D model - SOT23 (3-Pin) - U3+1
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MXD1818UR22+T Details

  • Manufacturer Part Number:

    MXD1818UR22+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    3-SOT_23-N/A

  • Package Description:

    TSSOP, SOT-323

  • Pin Count:

    3

  • Manufacturer Package Code:

    3-SOT_23-N/A

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2001-11-28

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Additional Feature:

    MNL RST:N;PW FL IO:N;PRG RST DLY:N;WD:N;WDO:N;WWD:N

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.92 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    SOT-323

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.12 mm

  • Supply Current-Max (Isup):

    0.016 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.2 V

  • Supply Voltage-Nom (Vsup):

    3.6 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +2.18V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.3 mm

MXD1818UR22+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MXD1818UR22+T involves keeping the input and output traces short and symmetrical, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure proper powering and decoupling, use a low-ESR capacitor (e.g., 10uF) between the VCC and GND pins, and a smaller capacitor (e.g., 100nF) between the VCC and GND pins for high-frequency decoupling. Additionally, use a 1uF capacitor between the VCC and AVCC pins for analog power supply decoupling.
  • The MXD1818UR22+T has an operating temperature range of -40°C to +125°C, but it's recommended to operate within -20°C to +85°C for optimal performance and reliability.
  • To handle ESD protection, use ESD protection diodes (e.g., TVS diodes) on the input and output pins, and ensure that the PCB design includes a solid ground plane and a dedicated ESD protection network.
  • The MXD1818UR22+T can operate with clock frequencies up to 100 MHz, but the recommended range is 10 MHz to 50 MHz for optimal performance and jitter tolerance.

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MXD1818UR22+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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