The recommended land pattern for N10SP005M is a rectangular pad with a size of 1.2mm x 0.8mm, with a solder mask clearance of 0.1mm.
Yes, N10SP005M is suitable for high-frequency applications up to 1 GHz due to its low equivalent series resistance (ESR) and high self-resonant frequency.
N10SP005M is rated for operation up to 150°C, making it suitable for high-temperature applications. However, its capacitance value may decrease by up to 10% at 150°C.
Yes, N10SP005M is compatible with lead-free soldering processes, including SAC305 and Sn96.5Ag3Cu0.5.
N10SP005M has an MSL rating of 1, indicating that it can withstand exposure to moisture for up to 30 days without requiring baking before reflow soldering.
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N10SP005M Overview
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