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N34TS108C6ECT5G - onsemi

Description: Dynamically-Programmable Limit Window with Under- and Over Temperature Alerts; Accuracy: ♦ ±0.75°C (max) from –20°C to +85°C ♦ ±1°C (max) from –40°C to +125°C; Low Quiescent Current: ♦6 µA Active from –40°C to +125°C; Supply Range: 1.4 V to 3.6 V; Resolution: 12 Bits (0.0625°C); Package: 1.2-mm × 0.8-mm, 6-Ball WCSP

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N34TS108C6ECT5G - onsemi - PCB symbol
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PCB Footprints
N34TS108C6ECT5G - onsemi PCB footprint - BGA - BGA - WLCSP6, 1.1888x0.788x0.625 CASE 567YQ ISSUE O
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3D Models
N34TS108C6ECT5G - onsemi - 3D model - BGA - WLCSP6, 1.1888x0.788x0.625 CASE 567YQ ISSUE O
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N34TS108C6ECT5G Details

  • Manufacturer Part Number:

    N34TS108C6ECT5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WLCSP6, 1.1888x0.788x0.625

  • Package Description:

    WLCSP-6

  • Manufacturer Package Code:

    567YQ

  • Factory Lead Time:

    20 Weeks

  • Date Of Intro:

    2019-12-02

  • Manufacturer:

    onsemi

  • YTEOL:

    8.6

  • Accuracy-Max (Cel):

    1 Cel

  • Body Breadth:

    0.788 mm

  • Body Height:

    0.625 mm

  • Body Length or Diameter:

    1.188 mm

  • JESD-609 Code:

    e1

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Bits:

    12

  • Number of Terminals:

    6

  • Operating Current-Max:

    0.0036 mA

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Interface Type:

    2-WIRE INTERFACE

  • Package Body Material:

    NOT SPECIFIED

  • Package Equivalence Code:

    BGA6,2X3,16

  • Package Shape/Style:

    RECTANGULAR

  • Sensors/Transducers Type:

    TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.4 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Termination Type:

    SOLDER

N34TS108C6ECT5G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current ranges, and that the PCB is designed to minimize thermal resistance. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • Exceeding the maximum Tj rating can lead to reduced device lifespan, increased leakage current, and potentially catastrophic failure. Ensure that the device is operated within the recommended temperature range to prevent premature failure.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins to protect against electrostatic discharge. Follow proper handling and storage procedures to prevent ESD damage during manufacturing and assembly.
  • Use a soldering temperature of 260°C (500°F) for a maximum of 10 seconds. Ensure that the soldering iron is set to a low temperature and the device is not exposed to excessive heat or moisture.

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N34TS108C6ECT5G Overview

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